IPDiA 935132424533

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  • Part Number:

    935132424533

  • Manufacturer:

    IPDiA

  • Category:

    Silicon Capacitors

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

    pdf 935132424533_Datesheet

  • Description:

    CAP SILICON 0.033UF 15% 11V 0402

  • In stock 935
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Specifications
Type
Paramete
Type
Paramete
Operating Temperature
-55°C ~ 200°C
Package / Case
0402 (1005 Metric)
Applications
High Temperature
ESR (Equivalent Series Resistance)
400 mOhms
Voltage - Breakdown
11 V
Features
High Reliability
Size / Dimension
0.047" L x 0.028" W (1.20mm x 0.70mm)
Capacitance
0.033 µF
Tolerance
±15%
ESL (Equivalent Series Inductance)
100pH
Height
0.016" (0.41mm)
Overview

DESCRIPTION



· HTSC424.xxx - 0402 High Temperature Silicon Capacitor is designed for applications requiring reliability up to 200°C.

· Utilizes unique IPDiA Silicon capacitor technology to solve problems in demanding applications.

· Offers capacitor integration capability up to 250nF/mm², similar to X7R dielectric but with superior electrical performance up to 200°C.

· Features the highest capacitor stability across a temperature range of -55°C to +200°C with a temperature coefficient lower than ±1%.

· Provides industry-leading performance with a failure rate of FIT <0.017 and is RoHS compliant.



FEATURES



· High stability up to 200°C with temperature coefficient <±1%, voltage coefficient <0.1%/V, and negligible capacitance loss through aging.

· Unique high capacitance in EIA/0402 package size, up to 47 nF.

· High reliability with FIT <0.017 parts per billion hours.

· Low leakage current down to 100 pA.

· Low ESL and Low ESR characteristics.

· Suitable for lead-free reflow soldering processes.



APPLICATIONS



· Suitable for all applications up to 200°C, including military, aerospace, and automotive industries.

· Ideal for high reliability applications.

· Replacement for X7R and C0G dielectrics.

· Used in decoupling, filtering, and charge pump applications such as motor management and temperature sensors.

· Facilitates downsizing in electronic components.



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