DESCRIPTION

· Ultra broadband silicon capacitors for high-frequency applications up to 110 GHz.
· Designed for DC blocking, coupling, and bypass grounding in optical and high-speed data systems.
· Manufactured using a semiconductor MOS process for high reliability and stability.
· Compatible with lead-free reflow soldering and standard JEDEC assembly rules.
· Available with ENIG terminations or lead-free prebumping depending on case size.

FEATURES

· Resonance-free design ensures ultra-low group delay variation.
· Ultra-low insertion loss due to excellent impedance matching.
· Low ESL and ESR in bypass grounding mode.
· High capacitance stability over temperature, voltage, and aging.
· Extended operating temperature range from -55 to 150°C.
· RoHS-compliant and suitable for high-speed automated manufacturing.

APPLICATIONS

· Optoelectronics and high-speed data systems.
· Trans-Impedance Amplifiers (TIA) and Receive-and-Transmit Optical Sub-Assembly (ROSA/TOSA).
· Synchronous Optical Networking (SONET) and broadband test equipment.
· Broadband microwave/millimeter wave applications.
· Replacement for X7R and NP0 capacitors in low-profile designs (400 or 100 µm).