Infineon Technologies BSP317PH6327XTSA1

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Specifications
Type
Paramete
Type
Paramete
Current - Continuous Drain (Id) @ 25°C
430mA (Ta)
Supplier Device Package
PG-SOT223-4
Qualification
AEC-Q101
FET Type
P-Channel
Power Dissipation (Max)
1.8W (Ta)
Rds On (Max) @ Id, Vgs
4Ohm @ 430mA, 10V
Gate Charge (Qg) (Max) @ Vgs
15.1 nC @ 10 V
FET Feature
-
Grade
Automotive
Vgs (Max)
±20V
Operating Temperature
-55°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Input Capacitance (Ciss) (Max) @ Vds
262 pF @ 25 V
Drain to Source Voltage (Vdss)
250 V
Package / Case
TO-261-4, TO-261AA
Vgs(th) (Max) @ Id
2V @ 370µA
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Technology
MOSFET (Metal Oxide)
Overview

BSP317PH6327XTSA1 Product Summary

Basic Information

  • Part Number: BSP317PH6327XTSA1
  • Package Type: PG-SOT223
  • Reel Information: H6327, 1000 pcs/reel

Electrical Characteristics

  • Drain-Source Voltage (VDS): -250 V
  • Drain Current (ID):Continuous: -0.43 A (TA=25°C), -0.34 A (TA=70°C)Pulsed: -1.72 A (TA=25°C)
  • Gate-Source Voltage (VGS): ±20 V
  • Power Dissipation (Ptot): 1.8 W (TA=25°C)
  • Operating and Storage Temperature (Tj, Tstg): -55... +150 °C
  • ESD Class: JESD22-A114-HBM Class 1b
  • Halogen-Free: Compliant with IEC61249-2-21

Thermal Characteristics

  • Thermal Resistance (RthJS): 15 to 25 K/W
  • Thermal Resistance (RthJA):SMD version, min. footprint: 80 to 115 K/WSMD version, 6 cm² cooling area: 48 to 70 K/W

Static Characteristics

  • Drain-Source Breakdown Voltage (V(BR)DSS): -250 V
  • Gate Threshold Voltage (VGS(th)): -1 to -2 V
  • Zero Gate Voltage Drain Current (IDSS): -0.1 to -10 µA (Tj=25°C), -0.2 to -100 µA (Tj=150°C)
  • Gate-Source Leakage Current (IGSS): -10 to -100 nA
  • Drain-Source On-State Resistance (RDS(on)):VGS=-4.5V, ID=-0.39A: 3.3 to 5 ΩVGS=-10V, ID=-0.43A: 3 to 4 Ω

Dynamic Characteristics

  • Transconductance (gfs): 0.38 to 0.76 S
  • Input Capacitance (Ciss): 210 to 262 pF
  • Output Capacitance (Coss): 30 to 37 pF
  • Reverse Transfer Capacitance (Crss): 13.4 to 16.7 pF
  • Turn-On Delay Time (td(on)): 5.7 to 8.5 ns
  • Rise Time (tr): 11.1 to 16.6 ns
  • Turn-Off Delay Time (td(off)): 254 to 381 ns
  • Fall Time (tf): 67 to 100 ns

Gate Charge Characteristics

  • Gate to Source Charge (Qgs): -0.5 to -0.65 nC
  • Gate to Drain Charge (Qgd): -4 to -5.2 nC
  • Total Gate Charge (Qg): -11.6 to -15.1 nC
  • Gate Plateau Voltage (V(plateau)): -2.8 V

Reverse Diode Characteristics

  • Inverse Diode Continuous Forward Current (IS): -0.43 A (TA=25°C)
  • Inverse Diode Pulsed Current (ISM): -1.72 A
  • Inverse Diode Forward Voltage (VSD): -0.84 to -1.2 V
  • Reverse Recovery Time (trr): 92 to 138 ns
  • Reverse Recovery Charge (Qrr): 210 to 315 nC

Additional Information

  • Qualified According to: AEC Q101
  • Packaging: Non-dry
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