DESCRIPTION

· Film chip capacitor with naked and stacked construction using metallized PEN (polyethylene naphtalate).

FEATURES

· High temperature dielectric films suitable for IR or vapor phase reflow processes.

· Excellent compatibility with all types of printed circuit board materials.

· Self-healing property ensures safety open failure mode and enhanced reliability.

· Superior thermal shock resistance.

· Low dissipation factor, ESR, and ESL.

· No piezoelectric effect.

· Available in tape and reel for automatic placement.

· Non-polar construction with 100% matte Sn Ni barrier under termination.

APPLICATIONS

· Automotive: Airbag, fuel injection calculator.

· Telecom: Public switching systems, modems, telephone sets, cordless, mobile.

· Industrial: SMPS, power converter module.