CC0402KRX7R9BB222 Specification Summary

Basic Information

• Manufacturer: Yageo
• Part Number: CC0402KRX7R9BB222
• Product: Surface-Mount Ceramic Multilayer Capacitor
• Description: General-purpose and high-capacitance X7R series capacitor, 100 V rated voltage, 220 pF capacitance, 0402 (1005) size

Part Number Breakdown

• CC: Series identifier for Yageo's chip capacitors
• 0402: Size code indicating the dimensions of the capacitor (1.0 mm x 0.5 mm)
• KR: Tolerance code (±10%)
• X7R: Temperature characteristic code (X7R material, ±15%)
• 9B: Voltage code (100 V)
• B: Packing style code (Paper/PE taping reel; Reel 7 inch)
• 222: Nominal capacitance code (220 pF)

Dimensions and Packaging

• Dimensions: 1.0 mm x 0.5 mm x 0.5 mm (length x width x thickness)
• Packaging: Available in different reel sizes, such as:B: Paper/PE taping reel; Reel 7 inch
• Quantity per Reel: 10,000 pcs

Electrical Characteristics

• Rated Voltage: 100 V
• Capacitance: 220 pF with a tolerance of ±10%
• Temperature Range: -55 °C to +125 °C
• Temperature Coefficient: ±15% (X7R characteristic)
• Insulation Resistance: ≥ 10 GΩ or ≥ 500 Ω·F (whichever is less)
• Dissipation Factor (D.F.): ≤ 10% (for capacitances ≤ 1 µF)

Construction

• Structure: The capacitor consists of a rectangular block of ceramic dielectric with interleaved metal electrodes. The inner electrodes are connected to the two end terminations and covered with a layer of plated tin (NiSn). The terminations are lead-free.

Applications

• General Applications: PCs, hard disks, game PCs, DVDs, video cameras, mobile phones, data processing

Features

• Compliance: RoHS compliant, Halogen Free
• Termination: Nickel-barrier end termination
• Moisture Sensitivity Level (MSL): MSL 1

Soldering Recommendation

• Soldering Method: Reflow soldering only
• Reflow Temperature: 260 ±5 °C
• Preheating: 120 °C to 150 °C for 1 minute
• Dipping Time: 10 ±0.5 seconds
• Recovery Time: 24 ±2 hours

Testing and Requirements

• Capacitance Measurement: Measured at room temperature with specified voltage and frequency conditions
• Dissipation Factor (D.F.): Measured at room temperature with specified voltage and frequency conditions
• Insulation Resistance: Measured at rated voltage (Ur) for 1 minute
• Temperature Coefficient: Measured at specified temperatures and calculated using the formula provided in the datasheet
• Adhesion Test: Applied force for 10 seconds parallel to the substrate
• Bending Strength: Tested with a bending radius of 5 mm at a rate of 1 mm/s
• Resistance to Soldering Heat: Preconditioned at 150 ±10 °C for 1 hour, then kept at room temperature for 24 ±1 hours
• Solderability: Preheated at 80 °C to 140 °C for 30 to 60 seconds
• Rapid Change of Temperature: 5 cycles with specified temperature and recovery times
• Damp Heat: 500 ±12 hours at 40 ±2 °C, 90 to 95% RH
• Endurance: Tested at specified temperatures and stress voltages for 1,000 hours
• Voltage Proof: Specified stress voltage applied for 1 minute