CL10A225KQ8NNNC Specification Summary

Basic Information

• Supplier: Samsung Electro-Mechanics
• Samsung Part Number: CL10A225KQ8NNNC
• Product: Multi-layer Ceramic Capacitor
• Description: CAP, 2.2㎌, 6.3V, ±10%, X5R, 0603

Part Number Breakdown

• Series: Samsung Multi-layer Ceramic Capacitor
• Size: 0603 (inch code) with dimensions L: 1.60±0.10㎜, W: 0.80±0.10㎜
• Dielectric: X5R
• Capacitance: 2.2㎌
• Capacitance Tolerance: ±10%
• Rated Voltage: 6.3V
• Thickness: 0.80±0.10㎜
• Packaging: Cardboard Type, 7" Reel, Quantity: 4K

Reliability Test Conditions

• Capacitance: Within specified tolerance (1±10%)
• Tan δ (DF): Initial spec.
• Insulation Resistance: Whichever is smaller (10,000Mohm or 100Mohm×㎌)
• Appearance: No abnormal exterior appearance under microscope (×10)
• Withstanding Voltage: No dielectric or mechanical breakdown at 250% of rated voltage
• Temperature Characteristics: Capacitance change within ±15% from -55℃ to 85℃
• Adhesive Strength: No peeling on terminal electrode
• Bending Strength: Capacitance change within ±10% with 1.0mm/sec bending
• Solderability: SnAg3.0Cu0.5 solder at 245±5℃ for 3±0.3sec (preheating at 80~120℃ for 10~30sec.)
• Vibration Test: Amplitude 1.5mm, 2hours × 3 directions (x, y, z)
• Moisture Resistance: With rated voltage, 40±2℃, 90~95%RH, 500hrs+12/-0hrs
• High Temperature Resistance: Max. operating temperature 1,000+48/-0hrs
• Temperature Cycling: 5 cycle test, Min. operating temperature → 25℃ → Max. operating temperature → 25℃

Recommended Soldering Method

• Reflow Soldering: Peak Temperature 260±5℃, 30sec.

Packaging Details

• Taping: Follows IEC 60286-3 standard
• Cover Tape Peel-off Force: 10 g.f ≤ peel-off force ≤ 70 g.f
• Box Packaging: Double packaging with paper type inner and outer boxes
• Chip Weight: Typical values provided for different sizes and temperature characteristics

Product Characteristic Data

• Capacitance Measurement: Conditions specified for Class I and Class II MLCCs
• Tan δ (DF): Defined as the ratio of loss energy to stored energy
• Insulation Resistance: Measured 1 minute after applying rated voltage
• Capacitance Aging: Decreases linearly with log of time for Class II MLCCs
• Temperature Characteristics of Capacitance (TCC): Values specified for different temperature ranges
• Self-heating Temperature: Consideration for AC or pulse voltage circuits
• DC & AC Voltage Characteristics: Capacitance changes with applied voltage
• Impedance Characteristic: Defined as Z=R+jX, with SRF (Self Resonant Frequency) considerations

Electrical & Mechanical Caution

• Derating: Voltage and temperature derating for derated MLCCs
• Applied Voltage: Caution for different types of voltage applied to MLCC
• Vibration and Shock: Consideration for mechanical stress and resonance
• Piezo-electric Phenomenon: Noise generation in specific frequency circuits

Mounting and Soldering Process

• Mounting Position: Recommended orientation and caution near cutouts and screws
• Reflow Soldering: Profile and temperature conditions
• Flow Soldering: Profile and caution for high capacitance and thin film MLCCs
• Soldering Iron: Preheating, contact time, and temperature control
• Cleaning: Caution for ultrasonic vibration and cleaning fluid selection
• Electrical Measuring Probes: Caution for PCB bending and support during testing
• PCB Cropping: Avoiding stress application after MLCC mounting
• Assembly Handling: Caution for PCB handling, component mounting, and adhesive selection

Design Considerations

• Circuit Design: Safety equipment installation for short-circuit prevention
• PCB Design: Consideration for thermal expansion coefficient differences
• Land Dimension: Recommended dimensions for different chip sizes and tolerances

Storage and Transportation

• Storage Environment: Temperature and humidity recommendations
• Shelf Life: Maximum 6 months from delivery date for solderability
• Transportation Conditions: Protection from excessive temperature, humidity, and mechanical forces

Disclaimer and Limitation

• Product Application: Not designed for aerospace, automotive, military, atomic energy, undersea, or other high-reliability applications
• Special Conditions: Contact sales personnel or application engineers for usage environment information