CL10A475KQ8NNNC Product Information

Product Overview

• Supplier: Samsung Electro-Mechanics
• Samsung Part Number: CL10A475KQ8NNNC
• Product Name: Multi-layer Ceramic Capacitor
• Description: CAP, 4.7uF, 6.3V, ±10%, X5R, 0603

Part Number Breakdown

• CL: Series (Samsung Multi-layer Ceramic Capacitor)
• 10: Size (0603 inch code)
• A: Dielectric (X5R)
• 475: Capacitance (4.7uF)
• K: Capacitance tolerance (±10%)
• Q: Rated Voltage (6.3V)
• 8: Thickness (0.80 ± 0.10 mm)
• N: Inner electrode (Cu, Ni, Sn 100%)
• N: Product (Normal)
• N: Special (Reserved for future use)
• C: Packaging (Cardboard Type, 7" reel)

Structure & Dimension

• Dimension (mm): Length: 1.60 ± 0.10 mm, Width: 0.80 ± 0.10 mm, Thickness: 0.80 ± 0.10 mm
• Termination Plating: Pb Free

Reliability Test and Judgement Condition

• Capacitance: Within specified tolerance (1kHz ±10%/1.0 ±0.2Vrms)
• Tan δ (DF): 0.1 max
• Insulation Resistance: 10,000 Mohm or 100 Mohm × μF (whichever is smaller)
• Appearance: No abnormal exterior appearance
• Withstanding Voltage: No dielectric breakdown or mechanical breakdown (250% of the rated voltage)
• Temperature Characteristics: X5R (From -55℃ to 85℃, capacitance change within ±15%)
• Adhesive Strength of Termination: No peeling on the terminal electrode (500g.f, for 10±1 sec)
• Bending Strength: Capacitance change within ±12.5% (Bending to the limit (1mm) with 1.0mm/sec)
• Solderability: More than 75% of the terminal surface to be soldered newly (SnAg3.0Cu0.5 solder 245±5℃, 3±0.3 sec. (preheating: 80~120℃ for 10~30 sec.))
• Resistance to Soldering Heat: Capacitance change within ±7.5% (Solder pot: 270±5℃, 10±1 sec)
• Vibration Test: Capacitance change within ±5% (Amplitude: 1.5mm, From 10Hz to 55Hz (return: 1min.), 2 hours × 3 directions (x, y, z))
• Moisture Resistance: Capacitance change within ±12.5% (With rated voltage 40±2℃, 90~95% RH, 500+12/-0 hrs)
• High Temperature Resistance: Capacitance change within ±12.5% (With 150% of the rated voltage, Max. operating temperature 1000+48/-0 hrs)
• Temperature Cycling: Capacitance change within ±7.5% (1 cycle condition: Min. operating temperature → 25℃ → Max. operating temperature → 25℃, 5 cycle test)

Recommended Soldering Method

• Reflow: Reflow Peak Temperature: 260±5°C, 10 sec. Max