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Central Semiconductor Corp CPS041-CS92D-CT
- Part Number:
CPS041-CS92D-CT
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- RoHs:
RoHS Compliant - Datasheet:
CPS041-CS92D-CT_Datesheet - Description:
SCR 400V 800MA DIE
- In stock 0
DESCRIPTION
· CS18D, BRX49, CS92D, and CS89M are principal device types.
· The process yields 6,474 gross dies per 4-inch wafer.
· Utilizes CPS041 Silicon Controlled Rectifier (SCR) chip process with glass passivated mesa.
· Die size is 41 x 41 MILS with a thickness of 8.7 MILS ± 0.6 MILS.
· Features cathode bonding pad area of 18 x 8 MILS and gate bonding pad area of 7.1 x 7.1 MILS.
· Top side metalization is Al - 45,000Å, back side metalization is Al/Mo/Ni/Ag - 20,000Å/5,000Å/5,000Å/2,000Å.
FEATURES
· Glass passivated mesa for enhanced reliability.
· Precise die dimensions and thickness control.
· Optimized bonding pad areas for efficient connectivity.
· Multi-layer back side metalization for improved performance.
APPLICATIONS
· Suitable for use in sensitive gate SCR applications.
· Ideal for power control and switching circuits.
· Can be integrated into various electronic devices requiring reliable rectification.
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