Infineon Technologies IRLZ44NL

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Specifications
Type
Paramete
Type
Paramete
Grade
-
Drain to Source Voltage (Vdss)
55 V
Supplier Device Package
TO-262
Vgs(th) (Max) @ Id
2V @ 250µA
Rds On (Max) @ Id, Vgs
22mOhm @ 25A, 10V
Drive Voltage (Max Rds On, Min Rds On)
4V, 10V
Input Capacitance (Ciss) (Max) @ Vds
1700 pF @ 25 V
FET Feature
-
Technology
MOSFET (Metal Oxide)
Vgs (Max)
±16V
Gate Charge (Qg) (Max) @ Vgs
48 nC @ 5 V
Power Dissipation (Max)
3.8W (Ta), 110W (Tc)
Mounting Type
Through Hole
Current - Continuous Drain (Id) @ 25°C
47A (Tc)
FET Type
N-Channel
Qualification
-
Operating Temperature
-55°C ~ 175°C (TJ)
Package / Case
TO-262-3 Long Leads, I2PAK, TO-262AA
Overview

IRLZ44NL – Complete Datasheet Summary

Infineon 55 V Logic-Level HEXFET Power MOSFET, Through-Hole TO-262 (I²PAK), Lead-Free


1. Device Identity

  • Base Part No.: IRLZ44N
  • Package Variant: IRLZ44NL (L = low-profile TO-262 / I²PAK)
  • Order Code: IRLZ44NLPbF (PbF = lead-free, RoHS)
  • Technology: 5th-generation HEXFET trench, logic-level gate drive
  • Manufacturer: Infineon Technologies (formerly International Rectifier)


2. One-Line Description

55 V, 47 A continuous, 22 mΩ max logic-level MOSFET in TO-262 for high-efficiency switching from 3.3 V / 5 V GPIO.


3. Key Features

  • Logic-Level Gate – fully enhanced with VGS = 4.5 V
  • Ultra-Low RDS(on) 0.022 Ω @ 10 V, 0.025 Ω @ 5 V, 0.035 Ω @ 4 V
  • 175 °C Operating Junction (silicon limited)
  • Fully Avalanche Rated – 210 mJ single-pulse, 25 A avalanche current
  • Fast Switching – 11 ns td(on), 15 ns td(off)
  • Low Package Profile – 2.3 mm seated height vs. standard TO-220
  • Lead-Free (PbF) and RoHS compliant
  • Compatible with existing TO-220 footprints (same 2.54 mm pin spacing)


4. Absolute Maximum Ratings (@ TJ = 25 °C unless noted)


ParameterSymbolValueUnit
Drain-Source VoltageVDS55V
Continuous Drain Current (TC = 25 °C)ID47A
Continuous Drain Current (TC = 100 °C)ID33A
Pulsed Drain Current (tP ≤ 10 µs)IDM160A
Max Power Dissipation (TC = 25 °C)PD110W
Max Power Dissipation (TA = 25 °C, PCB mounted)PD3.8W
Linear Derating Factor0.71W/°C
Gate-Source VoltageVGS±16V
Single-Pulse Avalanche EnergyEAS210mJ
Avalanche CurrentIAR25A
Repetitive Avalanche EnergyEAR11mJ
Peak Diode Recovery dv/dtdv/dt5V/ns
Operating & Storage TJ–55 … +175°C
Soldering Temperature (1.6 mm from case, 10 s)300°C


5. Thermal Characteristics


ParameterTypMaxUnit
Junction-to-Case (steady-state)1.41.4°C/W
Junction-to-Ambient (PCB mounted, steady-state)40°C/W


6. Electrical Characteristics (@ TJ = 25 °C unless noted)


ParameterConditionsMinTypMaxUnit
Static
V(BR)DSSID = 250 µA, VGS = 0 V55V
RDS(on)VGS = 10 V, ID = 25 A0.0220.025Ω
RDS(on)VGS = 5 V, ID = 25 A0.025Ω
RDS(on)VGS = 4 V, ID = 21 A0.035Ω
VGS(th)VDS = VGS, ID = 250 µA1.02.0V
gfsVDS = 25 V, ID = 25 A21S
IDSSVDS = 55 V, VGS = 0 V25µA
IDSSVDS = 44 V, TJ = 150 °C250µA
IGSSVGS = ±16 V±100nA
Dynamic
QgVGS = 5 V, VDS = 44 V, ID = 25 A48nC
Qgs8.6nC
Qgd25nC
td(on)VDD = 28 V, ID = 25 A, RG = 3.4 Ω11ns
tr84ns
td(off)26ns
tf15ns
CissVGS = 0 V, VDS = 25 V, f = 1 MHz1700pF
Coss400pF
Crss150pF
Source-Drain Diode
ISMOSFET symbol47A
ISM160A
VSDTJ = 25 °C, IS = 25 A, VGS = 0 V1.3V
trrTJ = 25 °C, IF = 25 A, di/dt = 100 A/µs80120ns
Qrr210320nC


7. Package Outline – TO-262 (I²PAK)

  • 3 leads, low-profile (2.3 mm seated)
  • Industry-standard 2.54 mm pin spacing – drop-in replacement for TO-220 in many designs
  • Lead finish: matte tin, Ni-barrier, Pb-free, RoHS
  • Weight: 1.6 g typical
  • Part marking:Line 1: International Rectifier logoLine 2: IRLZ44NLLine 3: Date-code & lead-free flag (P)Line 4: Lot-code & assembly site


8. Tape & Reel Information (optional for TO-262)

  • Tube packing: 50 pcs/tube (standard)
  • Bulk box: 500 pcs
  • Reel option: 800 pcs / 330 mm reel (special order)


9. Typical Applications

  • 3.3 V / 5 V logic-driven high-side or low-side switches
  • DC motors, solenoids, relays
  • PWM control of LED strips, heaters, fans
  • Switch-mode power supplies (sync-rectifier)
  • Battery management & e-fuse
  • Automotive auxiliary loads (after qualified design review)


10. Recommended Footprint & Soldering

  • Follow TO-220 pad pattern; heatsink hole Ø 3.3 mm
  • Solder by wave or hand; max 300 °C, 10 s, 1.6 mm from case
  • Application note AN-994 for reflow & thermal guidelines


11. Related / Alternative Parts

  • IRLZ44NS – same die in D²PAK surface-mount
  • IRLZ44NPbF – TO-220 full-height, lead-free
  • IRLB8721PbF – lower RDS(on) 8.7 mΩ, 30 V logic-level
  • BSC097N06NS5 – 60 V OptiMOS™ 5, 9.7 mΩ, SON 5×6
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