Model Information for LMV112SD-NS

• Part Number: LMV112SD-NS
• Description: 40 MHz Dual Clock Buffer
• Package Type: WSON NGQ 8-Pin
• Status: ACTIVE
• Eco Plan: 1000 (Green, RoHS & no Sb/Br)
• Lead/Ball Finish: Sn Level-1-260C-UNLIM
• Moisture Sensitivity Level (MSL): Level 1-260C-UNLIM
• Operating Temperature Range: -40°C to 85°C
• Device Marking: 112SD

Key Features:

• Small Signal Bandwidth: 40 MHz
• Supply Voltage Range: 2.4V to 5V
• Slew Rate: 110 V/μs
• Total Supply Current: 1.6 mA
• Shutdown Current: 59 µA
• Rail-to-Rail Input and Output
• Individual Buffer Enable Pins
• Crosstalk Rejection Circuitry
• 8-pin WSON, Pin Access Packaging
• Temperature Range: −40°C to 85°C

Electrical Characteristics:

• Small Signal Bandwidth (SSBW): 40 MHz (at -3 dB, VIN = 0.63 VPP)
• Full Power Bandwidth (FPBW): 28 MHz (at -3 dB, VIN = 1.6 VPP)
• Gain Flatness (GFN): < 0.1 dB (f > 100 kHz)
• Input-Referred Voltage Noise: 26 nV/√Hz (at 1 MHz)
• Output to Input Isolation: 91 dB (at 1 MHz)
• Crosstalk Rejection (CT): 54 dB (at 26 MHz, PIN = 0 dBm)
• Rise Time (tr): 7 ns (0.1 VPP Step, f = 1 MHz)
• Fall Time (tf): 6 ns
• Settling Time (ts): 118 ns (to 0.1%, 1 VPP Step, f = 1 MHz)
• Overshoot (OS): 41% (0.1 VPP Step, f = 1 MHz)
• Slew Rate (SR): 110 V/µs (VIN = 1.6 VPP, f = 26 MHz)

Package Information:

• Package Type: WSON NGQ 8-Pin
• Package Drawing: NGQ0008A
• Height: 0.8 mm max
• Exposed Metal: Package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

Additional Information:

• The LMV112 is designed to minimize the effects of spurious signals and increase drive capability.
• It is an easy replacement for discrete circuitry, simplifying board layout and minimizing layout-related parasitic components.
• Texas Instruments' advanced packaging offers direct PCB-IC evaluation via pin access.