Analog Devices Inc.(ADI) LTC6902IMS#PBF

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  • Part Number:

    LTC6902IMS#PBF

  • Manufacturer:

    Analog Devices Inc.(ADI)

  • Category:

    Display Drivers

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf LTC6902IMS#PBF_Datesheet

  • Description:

    IC OSC SILICON PROG 10MSOP

  • In stock 559
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Specifications
Type
Paramete
Type
Paramete
Count
-
Current - Supply
2.5 mA
Frequency
100kHz ~ 20MHz
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Qualification
-
Supplier Device Package
10-MSOP
Voltage - Supply
2.7V ~ 5.5V
Grade
-
Package / Case
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Type
Oscillator, Silicon
Overview


Information of Component Model LTC6902IMS#PBF


1. Basic Product Information


1.1 Product Series

Multiphase Oscillator with Spread Spectrum Frequency Modulation


1.2 Manufacturer

Linear Technology Corporation (LTC; LTC, LT are registered trademarks)


1.3 Core Function

Provides 2-, 3-, or 4-phase clock outputs with optional spread spectrum frequency modulation (SSFM) to improve EMC performance. Frequency and spread percentage are set by external resistors, offering high precision and low power consumption.


1.4 Key Features


  • Output Phases: Selectable 2-phase, 3-phase, or 4-phase configurations.
  • Frequency Range: 5kHz to 20MHz (adjustable via one external resistor RSET).
  • SSFM Function: Optional frequency spreading (set by one external resistor RMOD) to reduce peak electromagnetic radiation.
  • Precision Performance: Frequency error ≤1.5% (max, 5kHz–10MHz, TA=25°C), ±40ppm/°C temperature stability.
  • Low Power Consumption: Typical supply current 400µA (VS=3V, 1MHz frequency).
  • Fast Start-Up: 50µs to 1.5ms start-up time.
  • Output Driver: 100Ω CMOS output driver, compatible with 5kΩ and/or 10pF loads.
  • Supply Voltage: Single 2.7V to 5.5V supply.
  • Compliance: Pb-Free (indicated by #PBF suffix).

2. Ordering & Package Information


2.1 Ordering Details


ParameterSpecifications
Part NumberLTC6902IMS#PBF
Package Type10-Lead Plastic MSOP (MS Package; Reference LTC DWG # 05-08-1661)
Operating Temperature Range–40°C to 85°C (guaranteed to meet specified performance)
Storage Temperature Range–65°C to 150°C
Lead Temperature (Soldering, 10 sec)300°C
Thermal CharacteristicsTJMAX = 150°C, θJA = 250°C/W

2.2 Package Dimensions (Unit: mm / Inch)


DimensionMinimumNominalMaximum
3.2 – 3.45 (.126 – .136)3.23.3253.45
3.00 ± 0.102 (.118 ± .004)2.8983.003.102
0.497 ± 0.076 (.0196 ± .003)0.4210.4970.573
0.305 ± 0.038 (.0120 ± .0015)0.2670.3050.343
4.90 ± 0.15 (1.93 ± .006)4.754.905.05
0.889 ± 0.127 (.035 ± .005)0.7620.8891.016
0.17 – 0.27 (.007 – .011)0.170.220.27
0.13 ± 0.076 (.005 ± .003)0.0540.130.206

2.3 Pin Configuration (10-Lead MSOP, Top View)


Pin NumberPin NameFunction
1V+Supply Voltage (2.7V ≤ V+ ≤ 5.5V); bypass to GND with 0.1µF capacitor.
2DIVDivider Setting Input: GND (N=1), Open (N=10), V+ (N=100).
3PHPhase Setting Input: GND (2-phase, M=1), Open (3-phase, M=3), V+ (4-phase, M=4).
4OUT1Oscillator Output 1
5OUT2Oscillator Output 2
6OUT3Oscillator Output 3
7OUT4Oscillator Output 4
8GNDGround; connect to ground plane for best performance.
9MODSSFM Setting Input: Connect to V+ via RMOD (enable SSFM) or GND (disable SSFM).
10SETFrequency Setting Input: Connect to V+ via RSET to set oscillation frequency.

2.4 Recommended Soldering Pad Layout

Refer to the "RECOMMENDED SOLDER PAD LAYOUT" in the package diagram. Key notes:


  • Mold flash/protrusions shall not exceed 0.152mm per side.
  • Interlead flash/protrusions shall not exceed 0.152mm per side.
  • Lead coplanarity (bottom of leads after forming) ≤ 0.102mm (max).

3. Absolute Maximum Ratings (TA=25°C)


RatingSymbolValueUnit
Supply Voltage (V+ to GND)-–0.3 to 6V
Voltage on Any Pin (Referred to GND)-–0.3 to (V+ + 0.3)V
Operating Temperature Range-–40 to 85°C
Storage Temperature Range-–65 to 150°C
Lead Temperature (Soldering, 10 sec)-300°C

Note: Exceeding maximum ratings may impair device life or functionality.


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