MPXV7007DP Model Information

General Description

The MPXV7007DP is a monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing microcontrollers or microprocessors with analog-to-digital inputs. It combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal proportional to the applied pressure.

Features and Benefits

• Ideal for microprocessor or microcontroller-based systems
• Temperature compensated over -40°C to +125°C
• Thermoplastic (PPS) surface mount package
• Patented silicon shear stress strain gauge
• Available in differential and gauge configurations

Ordering Information

• Package Type: SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x 7.62 mm body
• Part Number: MPXV7007DP
• Package Options: Trays (1693-1) and Tape and Reel (1693-1)

Pinning Information

• Supply Voltage (VS): Pin 2
• Ground (GND): Pin 3
• Voltage Output (Vout): Pin 4
• Pins 1, 5, 6, 7, and 8 are NO CONNECTS for the small outline package device.

Maximum Ratings

• Maximum Pressure (Pmax): 75 kPa
• Storage Temperature (Tstg): -40°C to +125°C
• Operating Temperature (TA): -40°C to +125°C

Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted)

• Pressure Range: -7 kPa to 7 kPa
• Supply Voltage: 4.75 Vdc to 5.25 Vdc
• Supply Current: 7.0 mA to 10 mA
• Minimum Pressure Offset (Voff): 0.33 Vdc to 0.67 Vdc
• Full Scale Output (VFSO): 4.3 Vdc to 4.7 Vdc
• Full Scale Span (VFSS): 4.0 Vdc
• Accuracy: ±5.0% VFSS
• Sensitivity (V/P): -286 mV/kPa
• Response Time (tR): 1.0 ms
• Output Source Current at Full Scale Output (IO+): 0.1 mA
• Warm-up Time: 20 ms
• Offset Stability: ±0.5% VFSS

On-Chip Temperature Compensation, Calibration, and Signal Conditioning

The MPXV7007 series integrates shear-stress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip. This ensures performance over temperature and reliability.

Recommended Decoupling Circuit

A recommended decoupling circuit is shown in Figure 6 of the datasheet to interface the integrated sensor with the analog-to-digital input of a microprocessor or microcontroller.

Output Signal Relative to Pressure Input

The sensor output signal is shown in Figure 7, with typical, minimum, and maximum output curves for operation over a temperature range of 0°C to 85°C.

Pressure Side Identification

The P1 side (Pressure side) can be identified by the part marking on the device.

Minimum Recommended Footprint for Surface-Mounted Applications

The recommended footprint for surface-mount packages is shown in Figure 10 of the datasheet to ensure proper solder connection interface.