MPZ2012S221AT000 - Chip Beads for Power Line Noise Reduction

Overview

The MPZ2012S221AT000 is a chip bead designed for noise reduction in power lines and signal lines, offering low direct current resistance for compatibility with large currents and optimal performance in low power consumption applications.

Key Specifications

• Part Number: MPZ2012S221AT000
• Dimensions: 2.0 mm x 1.25 mm x 0.85 mm
• Material: Not specified in the provided document
• Impedance at 100 MHz: 220 Ω ±25%
• DC Resistance: 0.040 Ω
• Rated Current: 3 A
• Operating Temperature Range: -55°C to +125°C

Features

• Noise Reduction: Effective for noise removal in power lines and signal lines.
• Low DC Resistance: Suitable for applications requiring compatibility with large currents.
• Wide Operating Temperature Range: Ensures performance in various environmental conditions.

Applications

• Mobile Devices: Smartphones and tablet terminals.
• Consumer Electronics: PCs, recorders, and household appliances.
• Industrial Equipment: STBs, smart grids, and other industrial applications.

Measurement Equipment

• Impedance Measurement: E4991A+16192A, Keysight Technologies
• DC Resistance Measurement: Type-7556, Yokogawa

Compliance

• REACH SVHC-Free: Free from Substances of Very High Concern.
• Lead Free: Compliant with lead-free requirements.
• RoHS: Compliant with Restriction of Hazardous Substances Directive.
• Halogen Free: Free from halogens.

Packaging Information

• Package Type: Tape and Reel
• Package Quantity: 4,000 pcs/reel
• Reel Dimensions: ø180 mm, 2.0 mm tape thickness, ø13 mm sprocket hole
• Individual Weight: 8 mg

Recommended Land Pattern

• Dimensions in mm:Length: 1.5 ±0.2 mmWidth: 2.3 ±0.2 mmKeep-out Zone: 1.1 mm max.

Recommended Reflow Profile

• Preheating: 60 to 120 seconds at 150°C to 180°C
• Soldering: 30 to 60 seconds at 230°C to 260°C
• Peak Temperature: 230°C to 260°C
• Cooling: Natural cooling

Storage and Handling

• Storage Conditions:Temperature: 5°C to 40°CHumidity: 10% to 75% RHStorage Period: Up to 12 months
• Handling Precautions:Preheat components before soldering to avoid thermal shock.Avoid exposure to corrosive gases and magnetic fields.Ensure proper thermal design to account for self-heating.

Safety and Usage Reminders

• Do Not Use:In applications requiring higher safety or reliability standards.For purposes outside the specified delivery specifications.
• Special Applications:Contact manufacturer for applications such as aerospace, medical, or industrial control.