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Taiyo Yuden NR5040T3R3N
- Part Number:
NR5040T3R3N
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
- Description:
3.3 µH Shielded Drum Core, Wirewound Inductor 3.3 A 35.1mOhm Max Nonstandard
- In stock 51,344
NR5040T3R3N Accessories – Model Information
(Crossed to: LLXBD5050YAL3R3N)
1. Inductor Overview
| Parameter | Specification |
|---|---|
| Model | NR5040T3R3N (Legacy PN) → LLXBD5050YAL3R3N (Current PN) |
| Type | Wire-wound ferrite power inductor |
| Inductance | 3.3 µH ±30 % |
| Case Size | 4.9 mm × 4.9 mm × 4.1 mm max |
| Rated Current | 3.3 A (max) |
| Saturation Current | 3.8 A (max, ∆L = 30 %) |
| Temperature Rise | 3.3 A (max, ∆T = 40 °C) |
| DC Resistance | 35.1 mΩ max, 27 mΩ typ |
| Self-Resonant Freq | 32 MHz min |
| Operating Temp | −25 °C to +120 °C (includes self-heating) |
| Temp Coefficient | ±20 % inductance change |
| Test Frequency | 100 kHz |
| RoHS / REACH | RoHS 10/10, REACH 251/251 compliant |
| Halogen Free | Yes |
| Soldering Method | Reflow only |
| Lifecycle Status | Phaseout – check stock before design-in |
2. Packaging & Supply Information
| Item | Details |
|---|---|
| Standard Packaging | Embossed tape & reel |
| Minimum Order Qty | 1,500 pcs / reel |
| Tape Width | 12 mm |
| Reel Diameter | 330 mm (13″) standard |
3. Recommended Land Pattern (PCB Footprint)
| Dimension | Value (mm) | Notes |
|---|---|---|
| Pad Pitch | 1.5 | Center-to-center |
| Pad Width | 1.0 | Reflow-compatible |
| Pad Length | 1.8 | Thermal relief optional |
| Body Keep-out | 5.3 × 5.3 | Allow 0.2 mm clearance all sides |
Refer to Taiyo Yuden drawing “LLXBD5050 Land Pattern” for Gerber import.
4. Soldering & Handling Accessories
| Accessory Type | Recommendation / Part Number (if applicable) | Notes |
|---|---|---|
| Stencil Thickness | 0.12 mm – 0.15 mm | Laser-cut, stainless steel |
| Solder Paste | No-clean, Type 4 powder, SAC305 alloy | Avoid water-soluble flux |
| Reflow Profile | Peak 245 °C max, 230 °C ≥ 30 s | Follow Taiyo Yuden reflow curve |
| Pick-and-Place Nozzle | 4 mm rubber-tipped nozzle | Vacuum ≥ 60 kPa, avoid nozzle mark on top |
| Moisture Handling | MSL 1 (unlimited floor life) | Dry pack not required |
5. Engineering Support Documents
| Document Title | File / Link (Taiyo Yuden) | Content |
|---|---|---|
| Datasheet | LLXBD5050YAL3R3N_SS.pdf | Electrical specs, curves |
| Land Pattern | LLXB_5040_LandPattern.pdf | Recommended PCB footprint |
| Reflow Profile | LLXB_SolderingRecommendation.pdf | Time-temp curve, paste type |
| SPICE Model | LLXBD5050YAL3R3N.lib | S-parameter & saturation model |
| RoHS / REACH Cert | Available on request | 10/10 RoHS, 251/251 REACH |
6. Cross-Reference & Replacement
| Legacy PN | Current PN | Pin-to-Pin | Electrical Match | Status |
|---|---|---|---|---|
| NR5040T3R3N | LLXBD5050YAL3R3N | Yes | Yes | Phaseout – last-time-buy advised |
7. Summary Table – NR5040T3R3N / LLXBD5050YAL3R3N Accessory Overview
| Category | Specification / Accessory | Notes |
|---|---|---|
| Inductor | 3.3 µH, 3.3 A, 4.9 × 4.9 × 4.1 mm | Reflow-only, −25 °C ~ +120 °C |
| Packaging | 1,500 pcs / 12 mm embossed tape & 330 mm reel | MOQ = 1 reel |
| PCB Footprint | 1.5 mm pitch pads, 5.3 × 5.3 mm keep-out | Download from Taiyo Yuden |
| Soldering | SAC305 paste, 245 °C max peak, MSL 1 | Stencil 0.12–0.15 mm |
| Support Docs | Datasheet, land pattern, SPICE model, reflow curve | Free download at www.yuden.co.jp/en |
| Lifecycle | Phaseout – verify stock & last-time-buy dates | Replace with LLXBD5050YAL3R3N |
Note:
All mechanical drawings, reflow profiles, and environmental data are reference-only – always confirm the latest revision on Taiyo Yuden’s website before finalizing your design.
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