Microchip Technology PM8270B-F3EI

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  • Part Number:

    PM8270B-F3EI

  • Manufacturer:

    Microchip Technology

  • Category:

    Specialized

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

    pdf PM8270B-F3EI_Datesheet

  • Description:

    IC

  • In stock 0
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Specifications
Type
Paramete
Type
Paramete
Qualification
-
Supplier Device Package
1417-BFBGA (31x31)
Voltage - Supply
-
Applications
I/O Controller
Grade
-
Interface
PCI Express
Mounting Type
Surface Mount
Package / Case
1417-BGA
Overview

PM8270B-F3EI – Complete Datasheet & Application Summary


1. General Description

PM8270B-F3EI is a SmartIOC 2200 PCIe Gen 4 tri-mode storage controller from Microchip Technology. It provides 16-lane PCIe host connectivity and 16-lane NVMe/SAS/SATA storage support in a 31mm × 31mm BGA package. The device integrates a PCIe switch, SAS-4 24G PHYs, hardware RAID, and secure-boot root-of-trust, enabling high-performance, low-latency, and secure storage for enterprise servers, cloud storage, and hyper-scale data centers.


2. Key Features

Host Interface

  • PCIe Gen 4 x16 (16 GT/s per lane)
  • Backward compatible with Gen 3/2/1
  • Bifurcation: x1, x2, x4, x8, x16
  • Error containment: poisoned TLP blocking, completion timeout, downstream port containment

Storage Interface

  • 32 tri-mode lanes (configurable as 16 × 2 ports)
  • SAS-4 24G, SATA 6G, PCIe NVMe per port
  • Dynamic Channel Multiplexing (DCM) – aggregates slower drives over 24G links
  • Universal Backplane Management (UBM) – auto-negotiates link type & speed

Performance

  • >3M 4K random read IOPS
  • Up to 26GB/s throughput
  • Hardware RAID 0, 1, 10, 5 (cacheless)
  • Native HBA mode and fully transparent NVMe mode

Security

  • Hardware root-of-trust – secure boot & firmware update
  • AES-XTS 256-bit encryption (IEEE 1619) for SAS & NVMe data-at-rest
  • FIPS 140-2 Levels 1–3 certifiable
  • Secure Key Encryption Key (KEK) management


3. Part Number Decoding


SegmentMeaning
PM8270SmartIOC 2200, 16×16 lanes
BGeneration revision
F3EI31mm BGA, industrial temp, no encryption


4. Ordering Information (Extract)


Part NumberHost LanesDisk LanesEncryptionPackageSize
PM8270B-F3EI1616BGA31mm × 31mm
PM8271B-F3EI1616BGA31mm × 31mm
PM8274B-F3EI1632BGA31mm × 31mm
PM8275B-F3EI1632BGA31mm × 31mm


5. Functional Specifications

5.1 PCIe Host

  • Lanes: 16 × Gen 4 (16 GT/s)
  • Switch: Integrated Switchtec™ PCIe switch
  • Latency: <100ns to NVMe targets
  • NTB: Non-transparent bridging & address translation
  • Hot-Plug: Surprise & surprise-removal supported

5.2 Storage Ports

  • PHYs: 16 × 24G SAS-4, backward compatible 12G/6G
  • Protocols: SAS, SATA, NVMe (tri-mode per port)
  • Topologies:16 × single-link drives8 × 2-lane wide-port drivesMixed NVMe & SAS/SATA on same backplane
  • DCM: Near 100% bandwidth aggregation efficiency

5.3 RAID & Data Protection

  • Levels: 0, 1, 10, 5 (no cache required)
  • Stripe Size: 64KB default, configurable
  • Online Capacity Expansion (OCE)
  • RAID Migration & Volume Concatenation
  • Patrol Read & Consistency Check
  • Basic HW RAID – no external DRAM needed


6. Management & Software

Unified Smart Storage Stack

  • Drivers: Windows, Linux, VMware, FreeBSD, UEFI
  • Utilities:maxView™ GUI – web-based managementARCCONF CLI – scripting & automationvSphere & OpenStack plugins
  • Pre-Boot: UEFI HII GUI & CLI
  • Autonomous Event Monitor – SNMP, email, syslog
  • SMBus / I²C – side-band management (optional)


7. Security & Compliance


FeatureDescription
Secure BootCryptographically signed firmware
Secure UpdateAuthenticated & encrypted images
AES-XTS 256IEEE 1619 data-at-rest encryption (SAS & NVMe)
Key ManagementKEK derivation, zeroization, tamper detect
FIPS 140-2Certifiable up to Level 3
Root-of-TrustHardware-based key storage & measurement


8. Power & Thermal


ParameterTypicalMaxUnit
Power (16×16, RAID 0)8.511W
Power (16×32, RAID 5)1013W
Thermal Profile31mm heat-spreader compatible
TJ Max105°C
TC Case Max95°C
Airflow200 LFM recommended


9. Reference Designs & Topologies

A. Enterprise Boot + Performance

  • Host: x16 PCIe Gen 4
  • Topology: 2× RAID 1 (boot) + 12× NVMe (performance)
  • Benefit: Hardware RAID boot, transparent NVMe for data

B. Dense Cloud Storage

  • Host: x16 PCIe Gen 4
  • Topology: 32× SATA 6G HDD via DCM SAS-4 links
  • Benefit: 100% bandwidth aggregation, reduced cable count

C. Mixed Media Hyper-scale

  • Host: x16 PCIe Gen 4
  • Topology: 8× NVMe SSD + 16× SAS-4 SSD + 8× SATA HDD
  • Benefit: Single controller, single driver, unified management


10. Mechanical & Package


ParameterValue
Package31mm × 31mm BGA, 1.27mm pitch
Ball Count961 (31×31 array)
Height2.2mm max
RoHSYes (lead-free)
MSL3
Thermal PadYes (bottom center)


11. Environmental & Reliability

  • Operating Temp: 0°C to +70°C (commercial) / -40°C to +85°C (industrial on request)
  • Storage Temp: -55°C to +125°C
  • HTOL: 1000h @ 105°C
  • ESD: 2kV HBM, 500V CDM
  • Latch-up: >100mA


12. Support & Collateral

  • Evaluation Board: PM8270-EVB31 (available Q3-2024)
  • Firmware: Field-upgradable via UEFI, OS, or SMBus
  • Documentation:Datasheet (DS00003797A)Hardware Reference DesignThermal Design GuidemaxView User Manual
  • Software:Drivers & utilities download portalVMware & OpenStack pluginsUEFI HII images


13. Ordering Summary


Part NumberDescription
PM8270B-F3EISmartIOC 2200, 16×16, no encryption, 31mm BGA, industrial temp ready


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