NXP PNX9535E/V120,518

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  • Part Number:

    PNX9535E/V120,518

  • Manufacturer:

    NXP

  • Category:

    Thermal Management

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

    pdf PNX9535E/V120,518_Datesheet

  • Description:

    IC MEDIA PROCESSOR

  • In stock 0
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Specifications
Type
Paramete
Type
Paramete
Mounting Type
Surface Mount
Voltage - Supply
1.16V ~ 1.24V, 3.15V ~ 3.6V
Qualification
-
Applications
Multimedia
Core Processor
TriMedia™
Program Memory Type
-
Supplier Device Package
456-BGA (27x27)
Interface
GPIO, Host Interface, I2C, PCI, USB, XIO
Number of I/O
8
Package / Case
456-BGA
RAM Size
-
Grade
-
Controller Series
Nexperia
Operating Temperature
-40°C ~ 85°C (TA)
Overview

PNX9535E/V120,518 Model Information

General Description

The PNX9535E/V120,518 is a software-enabled video and multimedia entertainment platform designed for automotive applications. It provides high-quality video playback from a wide range of sources and formats, featuring advanced video post-processing algorithms and enhanced multimedia capabilities.

Features

  • Software-Enabled Platform: Supports various video and multimedia applications.
  • Dual Video MPEG Decoding and Rendering: Capable of decoding and rendering two video streams simultaneously.
  • Video Quality Enhancements: Includes proprietary algorithms for color correction, image noise reduction, sharpness enhancement, and more.
  • Memory Configuration: External DDR2 SDRAM memory options with 32-bit or 16-bit data width.
  • Connectivity: Features USB 2.0, I2C-bus, and programmable GPIO interfaces.
  • Audio Processing: Supports digital audio input and output with advanced audio processing capabilities.
  • Automotive Grade: Qualified according to AEC-Q100 Grade 3 standards.

Applications

  • Front Seat Entertainment (FSE) System
  • Rear Seat Entertainment (RSE) System
  • DVD or CD Playback Device
  • USB, SD Card, or HDD Audio/Video Playback
  • JPEG Viewer for Digital Camera Images
  • Dual Video Decoding and Rendering Device
  • In-Car Video Source Decoding
  • WiFi Audio/Video Streaming (DLNA Compliant)
  • Bluetooth Audio Streaming to Headphones

Ordering Information

  • Package: BGA456 (plastic ball grid array package; 456 balls; body 27 × 27 × 1.75 mm)
  • Version: V120,518

Pinning Information

  • Pin Configuration: BGA456 package with detailed pin allocation (refer to the datasheet for specific pin assignments).
  • Pin Description: Comprehensive pin descriptions for power supplies, DDR SDRAM memory interface, digital video input/output, digital audio, GPIO, PCI-bus, USB-bus, JTAG, I2C-bus, main control pins, and crystal oscillator pins.

Functional Description

  • Digital Video:Video Input: Supports multiple digital video input formats, including ITU-R 656 compliant, VESA compliant, and RGB Bayer encoded video.Video Output: Features a versatile VDO module with DVD-Descrambler, Quality Video Composition Processor (QVCP), and Memory Based Scaler (MBS).
  • Digital Audio:Audio Input: Capable of capturing up to 8 channels of audio input.Audio Output: Supports up to 8 channels of audio output with programmable sampling rates.
  • Peripheral Interfaces:DDR SDRAM Memory Interface: Supports 32-bit or 16-bit wide data bus with programmable timing parameters.Multifunctional GPIO Interface: 61-bit wide GPIO interface with multiplexed functions for video, audio, and other peripherals.PCI-bus and XIO Interface: Supports PCI 2.2 specification for easy integration into personal computer applications.USB-bus Interface: USB 2.0 HS OTG compliant for high-speed data transfer.Host Interface: High-speed interface for I2C-bus communication with a host processor.I2C-bus Interface: 5V tolerant standard I2C-bus interface.JTAG Interface: Dedicated JTAG interface for software development.

Limiting Values and Thermal Characteristics

  • Limiting Values: Absolute maximum ratings for various parameters, including supply voltages, input voltages, and temperature ranges.
  • Thermal Characteristics: Thermal resistance and power dissipation details.

Test Information

  • Quality Information: Compliance with AEC-Q100 standards.
  • Package Outline: Detailed dimensions and footprint information for the BGA456 package.
  • Soldering Information: Guidelines for wave and reflow soldering processes.
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