DESCRIPTION

· Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family is a compact, low-power memory solution integrating flash memory and SRAM in one package.

FEATURES

· Combines Flash Memory and SRAM to reduce board space and simplify PCB design.
· SCSP technology offers the smallest memory subsystem footprint with dimensions of 8x10 mm for 16 Mbit Flash + 2/4 Mbit SRAM and 8x12 mm for 32 Mbit Flash + 4/8 Mbit SRAM.
· Features a height of 1.20 mm for 16/32 Mbit Flash + 2/4/8 Mbit SRAM and 1.40 mm for 32 Mbit Flash + 4 Mbit SRAM.
· Supports 0.25 µm, 0.18 µm, and 0.13 µm technologies.
· Advanced SRAM technology with 70 ns access time and low power operation.
· Intel® Flash Data Integrator (FDI) software enables real-time data storage and code execution.
· Advanced+ Boot Block Flash Memory with 70 ns access time, individual block locking, and a 128-bit protection register.
· Supports 12 V production programming and fast program and erase suspend.
· Operates in extended temperature ranges from -25°C to +85°C.
· Blocking architecture with 4-Kword parameter blocks and 64-Kbyte main blocks, supporting 100,000 erase cycles per block.
· Low power operation with 9 mA asynchronous read current and 7 µA standby current.
· Utilizes 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII Flash Technologies.

APPLICATIONS

· Ideal for low-power applications requiring compact, high-speed memory solutions.
· Suitable for systems needing integrated code and data storage with enhanced security features.