Infineon Technologies S29GL128S10FHI010

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  • Part Number:

    S29GL128S10FHI010

  • Manufacturer:

    Infineon Technologies

  • Category:

    Memory

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf S29GL128S10FHI010_Datesheet

  • Description:

    IC FLASH 128MBIT PARALLEL 64FBGA

  • In stock 0
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Specifications
Type
Paramete
Type
Paramete
Qualification
-
Write Cycle Time - Word, Page
60ns
Grade
-
Memory Type
Non-Volatile
Package / Case
64-LBGA
Memory Format
FLASH
Voltage - Supply
2.7V ~ 3.6V
Mounting Type
Surface Mount
Memory Size
128Mbit
Technology
FLASH - NOR
Clock Frequency
-
Memory Organization
8M x 16
Supplier Device Package
64-FBGA (13x11)
Memory Interface
Parallel
Access Time
100 ns
Operating Temperature
-40°C ~ 85°C (TA)
Overview

DESCRIPTION

· The S29GL01G/512/256/128S are MIRRORBIT™ Eclipse flash products fabricated on 65-nm process technology.
· These devices offer fast page access time of 15 ns and random access time of 90 ns.
· They feature a Write Buffer allowing up to 256 words/512 bytes to be programmed in one operation.
· Ideal for embedded applications requiring higher density, better performance, and lower power consumption.



FEATURES

· CMOS 3.0 V core with versatile I/O.
· 65 nm MIRRORBIT™ Eclipse technology.
· Single supply (VCC) for read/program/erase (2.7 V to 3.6 V).
· Wide I/O voltage range (VIO): 1.65 V to VCC.
· ×16 data bus.
· Asynchronous 32-byte page read.
· 512-byte programming buffer.
· Automatic error checking and correction (ECC).
· Sector erase with uniform 128-kbyte sectors.
· Suspend and resume commands for program and erase operations.
· Advanced sector protection (ASP).
· Separate 1024-byte one time program (OTP) array with two lockable regions.
· Common flash interface (CFI) parameter table.
· Temperature range: Industrial (–40°C to +85°C), Industrial plus (–40°C to +105°C), Automotive, AEC-Q100 grade 3 (–40°C to +85°C), Automotive, AEC-Q100 grade 2 (–40°C to +105°C).
· 100,000 program/erase cycles.
· 20 years data retention.



APPLICATIONS

· Embedded systems requiring high-density flash memory.
· Applications needing fast programming and erase operations.
· Systems with low power consumption requirements.
· Automotive and industrial applications with extended temperature ranges.



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