NXP SE98APW,118

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  • Part Number:

    SE98APW,118

  • Manufacturer:

    NXP

  • Category:

    Thermal Management

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf SE98APW,118_Datesheet

  • Description:

    IC TEMP SENSOR DDR 8-TSSOP

  • In stock 0
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Specifications
Type
Paramete
Type
Paramete
Topology
ADC (Sigma Delta), Register Bank
Operating Temperature
-40°C ~ 125°C
Grade
-
Qualification
-
Supplier Device Package
8-TSSOP
Accuracy
±4°C(Max)
Mounting Type
Surface Mount
Function
Temp Monitoring System (Sensor)
Output Fan
Yes
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Sensing Temperature
-40°C ~ 125°C
Sensor Type
Internal
Voltage - Supply
1.7V ~ 3.6V
Output Alarm
Yes
Output Type
I2C/SMBus
Overview

DESCRIPTION

· The NXP SE98A is a high-precision temperature sensor designed for DIMM modules, operating from -40°C to +125°C with ±1°C accuracy between +75°C and +95°C.

· It features an 11-bit ADC for temperature monitoring, updating readings 8 times per second, and supports I2C-bus/SMBus communication.

· The sensor operates within a voltage range of 1.7 V to 3.6 V and includes programmable registers for shutdown, low-power modes, and temperature event boundaries.

· It provides an open-drain EVENT output configurable as active LOW or HIGH, suitable for thermostat operations or microprocessor-based systems.

· The SE98A supports up to eight devices on a single bus via three address pins and includes SMBus TIMEOUT to prevent system lock-ups.



FEATURES

· JEDEC (JC-42.4) TS3000B1 DIMM compliant with ±0.5°C typical accuracy between 75°C and 95°C.

· Optimized for a voltage range of 1.7 V to 3.6 V with a shutdown current of 0.1 μA (typical) and 5.0 μA (maximum).

· 2-wire I2C-bus/SMBus interface compatible, operating from 0 Hz to 400 kHz.

· Includes SMBus ALERT and programmable TIMEOUT functions.

· 11-bit ADC providing 0.125°C resolution for temperature-to-digital conversion.



APPLICATIONS

· Ideal for monitoring DRAM temperature in custom DIMM modules, especially where larger SPD is required.

· Suitable for mobile platform memory module thermal sensing in accordance with JEDEC specifications.

· Can be used in microprocessor-based systems for temperature event interrupt outputs.

· Applicable in systems requiring critical temperature monitoring with configurable EVENT output signals.



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