1. General Information:

• Part Name: Multilayer Chip Ceramic Capacitor
• Specification: General Series
• Approval Sheet No.: DRAAW108F/0-2015
• Issued Date: [Date Not Specified]
• Manufacturer: Chaozhou Sanhuan (Group) Co., Ltd.
• Address: Sanhuan Industrial City, Fengtang, Chaozhou, Guangdong, China
• Phone: 86-768-6855932
• Fax: 86-768-6855921
• Website: HTTP://WWW.CCTC.CC

2. Document Details:

• Document No.: DRAAW108F/0-2015
• Pages: 44
• Name: Multilayer Chip Ceramic Capacitor (Product Approval)
• Date of Establishment: 2012.01
• Revisions:

3. Capacitor and Dielectric Classification:

• COG: Class I capacitors, stable electrical properties, suitable for low-loss and high-stability circuits like filters, oscillators, and timing circuits.
• X7R, X5R: Class II capacitors, higher dielectric constant, semi-stable temperature characteristics, used in circuits like DC-blocking, decoupling, bypassing, and frequency discriminating.
• Y5V: Class II capacitors, highest dielectric constant, sensitive to temperature and voltage, suitable for circuits requiring high capacitance with moderate temperature variation.

4. Product Structure:

• 1. Ceramic Dielectric
• 2. Inner Electrode
• 3. Outer Electrode
• 4. Nickel Layer
• 5. Tin Layer

5. Product Specification Naming Rules:

• TCC 0805 Y5V 105 M 500 D T

6. Product Capacitance Range:

• 0402 (1005) Size, 0603 (1608) Size, 0805 (2012) Size, 1206 (3216) Size, 1210 (3225) Size, 1808 (4520) - 1812 (4532) Size, 2220 (5750) - 2225 (5764) Size
• Please refer to the document for specific capacitance values and voltage ratings for each size and dielectric type.

7. Technical Requirements and Test Conditions:

• Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Strength, Temperature Coefficient of Capacitance, Adhesion, Solderability of Termination, Resistance to Leaching, Bending, Resistance to Soldering Heat, Temperature Cycle, Moisture Resistance, Damp Heat with Load, and Life Test
• Detailed specifications and testing conditions are provided in the document.

8. Packaging:

• Bulk Packing: 10,000 pieces per bag or as per customer request.
• Tape Packing: Varying quantities per reel depending on the size, with dimensions and specifications detailed in the document.

9. Precautions on the Use of MLCC:

• PCB Design, Automatic Placement, Soldering Profiles, Handling of Breakaway PC Boards, Storage, and Voltage & Temperature Considerations
• Detailed guidelines and recommendations are provided in the document.