VSC8502-03 XML Model Information

Overview:
The VSC8502-03 is a 10/100/1000BASE-T Ethernet PHY device designed for space-constrained applications. It features integrated line-side termination to save board space, reduce EMI, and improve system performance. The device also integrates RGMII timing compensation, eliminating the need for on-board delay lines. With Microchip’s EcoEthernet™ v2.0 technology, it supports IEEE 802.3az Energy Efficient Ethernet (EEE) and power-saving features to reduce power consumption based on link state and cable reach.

Key Features:

• Two integrated 10/100/1000BASE-T Ethernet copper transceivers (IEEE 802.3ab compliant) with VeriPHY® cable diagnostics software.
• Patented line driver with low EMI voltage mode architecture and integrated line-side termination resistors.
• HP Auto-MDIX and manual MDI/MDIX support.
• RGMII/GMII MAC interface.

Best in Class Power Consumption:

• EcoEthernet™ v2.0 green energy efficiency with ActiPHY™, PerfectReach™, and IEEE 802.3az Energy Efficient Ethernet (EEE).
• Fully optimized power consumption for all link speeds.
• Clause 45 registers to support Energy Efficient Ethernet and IEEE 802.3bf.

Key Specifications:

• Compliant with IEEE 802.3 (10BASE-T, 100BASE-TX, and 1000BASE-T) specifications.
• Supports GMII, RGMII version 1.3, and 2.5 V and 3.3 V CMOS for RGMII version 2.0.
• Operating temperatures range from –40 °C ambient to 125 °C junction or 0 °C ambient to 125 °C junction.
• Optionally reports if a link partner is requesting inline Power over Ethernet (PoE and PoE+).
• Available in a 12 mm x 12 mm, 135-pin multi-row QFN package.

Block Diagram:
The block diagram illustrates the primary functional blocks of the device, including the LED interface, RGMII/GMII/MII MAC interface, JTAG, and the management and control interface (MIIM).

Specifications:

• The device is compliant with various electrical specifications detailed in sections 6.1 through 6.4, covering DC characteristics, AC characteristics, operating conditions, and stress ratings.

Package Information:

• The XML package is a lead-free (Pb-free), 135-pin, multi-row quad flat no-lead (QFN) package with an exposed pad, measuring 12 mm × 12 mm in body size, with a 0.65 mm pin pitch and a maximum height of 0.85 mm.

Thermal Specifications:
Thermal specifications are based on the JEDEC JESD51 family of documents and are modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p PCB).

Moisture Sensitivity:
The device is rated moisture sensitivity level 4 as specified in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020.

Revision History:

• Rev. B - 01/2022: The On-Chip Voltage Regulator feature is removed from the device.
• Rev. A - 11/2021: Initial publication of this document.