Semtech Corporation GS6042-INE3


- Part Number:
GS6042-INE3
- Manufacturer:
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- RoHs:
RoHS Compliant - Datasheet:
- Description:
IC INTERFACE SPECIALIZED 16QFN
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GS6042-INE3 6G UHD-SDI/3G/HD/SD Adaptive Cable Equalizer - Datasheet Summary
Manufacturer: Semtech (Gennum Products)
Part Number: GS6042-INE3
Revision: Rev.4 (September 2015)
Package: Pb-free 16-pin QFN (4mm x 4mm), single unit packaging (non-tape/reel)
Operating Temperature Range: -40°C to +85°C
Compliance: Pb-free, RoHS compliant (no halogenated flame retardant in encapsulation)
1. Key Features
- Supports data rates from 125Mb/s to 6.25Gb/s, compliant with SMPTE ST 2081 (proposed), ST 424, ST 292, ST 259; also supports DVB-ASI (270Mb/s) and MADI (125Mb/s).
- Automatic adaptive cable equalization with typical Belden 1694A cable reach: 80m @5.94Gb/s, 210m @2.97Gb/s, 300m @1.485Gb/s, 500m @270Mb/s.
- Manual equalizer bypass control, programmable carrier detect with squelch threshold adjustment (SQ_ADJ pin).
- Automatic power-down (sleep mode) on loss of input signal; sleep mode power consumption is only 35mW (180mW typical in normal operation).
- Differential output supports DC-coupling to +1.2V to +3.3V CML logic via VCC_O pin adjustment.
- Optional 6dB flat band input gain (GAIN_SEL pin) and selectable output de-emphasis (2dB, 6dB, 8dB) via OP_CTL pin.
- Standard EIA/JEDEC logic for all control and status signals; single +3.3V core power supply operation.
- PCB footprint compatible with Semtech GS2974A, GS2974B, GS2984, GS2994, GS3440.
- Integrates DC restoration for SMPTE pathological signal compensation and carrier detect (CD) output for signal presence indication.
2. Electrical Characteristics
2.1 Absolute Maximum Ratings
- Supply Voltage (Core/Output Driver): -0.5V to +3.6V DC
- Input ESD Voltage (HBM): 5kV
- Storage Temperature: -50°C to +125°C
- Input Voltage Range: -0.3V to (VCC_A +0.3)V
- Solder Reflow Temperature: 260°C
2.2 DC Electrical Characteristics (VCC_A = +3.3V ±5%, -40°C ≤ TA ≤85°C)
- Core Supply Voltage (VCC_A): 3.135V (min) – 3.465V (max)
- Output Driver Supply Voltage (VCC_O): 1.2V/2.5V/3.3V ±5%
- Power Consumption (PD): 180mW (VCC_O=1.2V, 425mVppd swing); 240mW (max, VCC_O=3.3V, 850mVppd swing); 35mW (sleep mode)
- Input Logic Levels (GAIN_SEL/BYPASS/SLEEP): VIH=1.7V (min), VIL=0.7V (max) (2.5V pins, 3.3V tolerant)
- CD Output Voltage: VCD(OH)=2.0V (min, no signal), VCD(OL)=0.4V (typ, signal present)
- Input Common Mode Voltage (VCMIN): 1.7V (typ)
2.3 AC Electrical Characteristics (VCC_A = +3.3V ±5%, -40°C ≤ TA ≤85°C)
- Serial Input Data Rate (DRDDO): 125Mb/s (min) – 6250Mb/s (max)
- Input Voltage Swing (ΔVSDI): 720–950mVppd (270Mb/s/1.485Gb/s); 720–880mVppd (2.97Gb/s/5.94Gb/s)
- Output Voltage Swing (ΔVDDO): 350–500mVppd (low swing); 700–1000mVppd (high swing) @100Ω differential load
- Output Jitter: ≤0.5UI (max) at maximum supported Belden 1694A cable lengths for all data rates
- Output Rise/Fall Time (tr/tf): 75ps (5.94/2.97/1.485Gb/s); 150ps (270Mb/s) (20%–80%)
- Input Return Loss: ≥15dB (5MHz–1.485GHz); ≥10dB (1.485GHz–2.97GHz)
- Single-ended Impedance: Input 1.9kΩ (typ), Output 50Ω (typ); Input Capacitance: 1.3pF (typ)
3. Pinout & Pin Functions (16-pin QFN, Top View)
The device features a central ground pad (internally bonded to VEE_A, requires ≥5 vias to GND) and key functional pins as follows:
表格
| Pin No. | Name | Type | Core Function |
|---|---|---|---|
| 1 | VEE_A | Power | Negative supply for input buffer/core/control (connect to GND) |
| 2/3 | SDI/SDI | Input | Differential serial digital input |
| 4 | GAIN_SEL | Input | Enables 6dB flat band input gain (HIGH) or no gain (LOW) |
| 5/6 | AGC/AGC | - | External AGC capacitor connection |
| 7 | BYPASS | Input | Disables equalizer/DC restore (HIGH); internal pull-down |
| 8 | SQ_ADJ | Input | Adjusts carrier detect threshold; internal pull-down (disabled in auto-sleep) |
| 9 | OP_CTL | Input | Controls output swing, de-emphasis and mute (9 programmable levels) |
| 10/11 | DDO/DDO | Output | Differential serial digital output |
| 12 | VEE_O | Power | Negative supply for output buffer (connect to GND) |
| 13 | VCC_O | Power | Positive supply for output buffer (1.2V–3.3V DC) |
| 14 | SLEEP | Input | Enables low-power sleep mode (HIGH); connect to CD for auto-sleep |
| 15 | CD | Output | Carrier detect (LOW=valid signal, HIGH=no signal); 2.5V logic output |
| 16 | VCC_A | Power | Positive supply for input buffer/core/control (+3.3V DC) |
Key Programmable Pin Modes
- GAIN_SEL: 0 = no gain; 1 = 6dB flat band gain
- SLEEP: 0 = normal operation; 1 = sleep mode (CD remains active)
- OP_CTL: 9 analog levels for swing (425/850mVppd), de-emphasis (0/2/6/8dB) and mute (2.416–2.5V)
- CD & SQ_ADJ: CD directly connects to SLEEP for auto-sleep (SQ_ADJ disabled in this mode)
4. Core Functional Blocks
- Serial Digital Input (SDI) stage with differential/single-ended support (AC-coupling recommended)
- Adaptive cable equalizer (inverse frequency response of Belden 1694A cable)
- DC restoration stage for pathological signal compensation
- AGC (Automatic Gain Control) with external capacitor connection
- Programmable squelch adjust (SQ_ADJ) for carrier detect threshold
- Differential output driver (DDO) with adjustable swing/de-emphasis/mute
- Carrier detect (CD) and sleep control with auto-sleep capability
- Power management for normal/sleep mode operation
5. Application Information
5.1 Target Applications
- SMPTE ST 2081/424/292/259 coaxial cable serial digital interfaces
- Serialized 8b/10b encoded video streams up to 6.25Gb/s (6G UHD-SDI, 3G-SDI, HD-SDI, SD-SDI)
- Professional video equipment (routers, transmitters, receivers, video processors)
- DVB-ASI and MADI audio/video serial interfaces
5.2 PCB Layout Guidelines
- Use controlled impedance transmission lines for PCB traces >1cm (FR-4 dielectric acceptable)
- Match high-speed trace width to SMT component width to minimize reflections
- Curve high-speed traces to avoid impedance changes
- Cut inner layers under input/output components to reduce parasitic capacitance
- Connect central ground pad to VEE_A with ≥5 vias for thermal and electrical performance
5.3 Recommended Circuits
- Extended Cable Reach Circuit: Optimized for maximum Belden 1694A cable support, with AC-coupled SDI input and configurable termination.
- Drop-in Replacement Circuit: Footprint-compatible with Semtech’s legacy equalizers (GS2974A/B, etc.), with 75Ω single-ended SDI input termination.
6. Packaging & Ordering
6.1 Package Specifications
- Type: 4mm x 4mm 16-pin QFN (JEDEC M0220)
- Moisture Sensitivity Level (MSL): 1
- Thermal Resistance: θJC=31.0°C/W (junction to case); θJA=43.8°C/W (junction to air, zero airflow)
- Psi, W: 11.0°C/W
6.2 Related Part Numbers (Same Die, Different Packaging)
- GS6042-INTE3: Pb-free 16-pin QFN (250pcs, tape and reel)
- GS6042-INTE3Z: Pb-free 16-pin QFN (2500pcs, tape and reel)All variants operate at -40°C to +85°C.
6.3 Solder Reflow Profile (Pb-free)
- Preheat: 60–150s (temperature ramp ≤3°C/sec)
- Reflow: 20–40s at ≥217°C, peak temperature 260°C (max)
- Total reflow time (≥200°C): ≤60–180s; total process time ≤8min
- Cool down ramp ≤6°C/sec
7. Revision History
- 0 (Jun 2013): New document release
- 1 (Nov 2013): Added 6.25G support, updated jitter characteristics and general content
- 2 (Feb 2014): Converted to Final Data Sheet, modified Section 4.3, added 6G SMPTE standard reference
- 3 (May 2014): Corrected de-emphasis level values
- 4 (Sep 2015): Added tape and reel options to ordering information (Table 6-2)
8. Important Notices
- The device is not designed/authorized for life-support, nuclear, or high-risk applications where failure may cause personal injury, property damage or environmental harm.
- Semtech reserves the right to modify product specifications and documentation without prior notice.
- All sales follow Semtech’s standard terms and conditions; product performance is warranted to published specifications at the time of sale.
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Semtech Corporation

Semtech Corporation

Semtech Corporation

Semtech Corporation

Semtech Corporation

Semtech Corporation

Semtech Corporation

Semtech Corporation

Semtech Corporation









