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High-Performance TQP3M9018 LNA – Request Your Quote Today

Aug 28, 2025 419

TQP3M9018 Product Overview

The TQP3M9018 is a high-linearity, cascade-capable gain block amplifier offered in a cost-effective surface-mount package. At 1.9 GHz, it typically delivers 20.5 dB of gain, an output IP3 of +37 dBm, and a low 1.3 dB noise figure, while consuming just 85 mA of current. The device comes in a lead-free, green, RoHS-compliant, industry-standard 16-pin 3x3 mm QFN package.

High-Performance TQP3M9018

High-Performance TQP3M9018

The TQP3M9018 provides consistently high gain across a wide frequency range along with a very low noise figure. This makes it suitable for both transmitter and receiver signal chains in high-performance systems. Built on a high-performance E-pHEMT process, the amplifier is internally matched and requires only an external RF choke plus blocking or bypass capacitors to run from a single +5 V supply. Its integrated active bias circuit ensures stable performance over variations in bias and temperature.

Covering the 0.02–4 GHz frequency range, the TQP3M9018 is designed for use in wireless infrastructure as well as other applications where excellent linearity and/or low noise are critical.

Key Features

  • Wide frequency range: 20–4000 MHz
  • 20.5 dB gain at 1900 MHz
  • Low noise figure of 1.3 dB at 1900 MHz
  • High linearity with +37 dBm output IP3
  • 50-ohm gain block, supports cascading
  • Unconditional stability across operating conditions
  • Handles high input power levels
  • Operates from a single +5 V supply, drawing 85 mA
  • Compact 3x3 mm QFN package

Applications

  • Signal repeaters
  • Mobile communication infrastructure
  • LTE, WCDMA, CDMA, and EDGE systems
  • General-purpose wireless solutions

TQP3M9018 Package Marking and Dimensions

  • Package Marking: Part number – 9018
  • Date/Origin Code: Year/Week/Country – YYWW
  • Lot Code: aXXXX

TQP3M9018 Dimensions

TQP3M9018 Dimensions

Notes:

  1. All measurements are in millimeters; angles are in degrees.
  2. Dimensions and tolerances follow the ASME Y14.4M-1994 standard.
  3. Terminal #1 identification and numbering follow JESD 95-1 SPP-012 standards.

TQP3M9018 Pad Configuration and Description

TQP3M9018 Functional Block Diagram

TQP3M9018 Functional Block Diagram

Recommended PCB Layout Pattern

COMPONENT SIDE

COMPONENT SIDE

Notes:

  1. All dimensions are in millimeters (inches); angles are in degrees.
  2. Use a minimum of 1 oz. copper for both top and bottom PCB layers.
  3. Ground and thermal vias are required for proper device operation. Recommended via drill: 0.35 mm (#80 / 0.0135”) with a finished plated thru diameter of 0.25 mm (0.010”).
  4. Ensure a solid solder connection for the package backside exposed pad (EP) to achieve optimal electrical and thermal performance.

Tape and Reel Information – Carrier and Cover Tape Dimensions

Carrier and Cover Tape Dimensions

Feature Dimensions – Carrier Tape

FeatureMeasurementSymbolSize (in)Size (mm)
Cavity LengthA00.1253.20
Cavity WidthB00.1253.20
Cavity DepthK00.0391.00
Cavity PitchP10.1574.00
Centerline Distance – Cavity to Perforation (Length Direction)P20.0792.00
Centerline Distance – Cavity to Perforation (Width Direction)F0.2175.50
Carrier Tape WidthW0.47212.0

Tape and Reel Information – Reel Dimensions

Standard T/R size = 2,500 pieces on a 7” reel.

Tape and Reel Information – Reel Dimensions

Tape and Reel Information – Reel Dimensions

Feature Dimensions – Reel / Flange


FeatureMeasurementSymbolSize (in)Size (mm)
Flange DiameterA6.969177.00
Flange ThicknessW20.71718.20
Space Between FlangesW10.50412.80
Hub Outer DiameterN2.28358.00
Arbor Hole DiameterC0.51213.00
Key Slit WidthB0.0792.00
Key Slit DiameterD0.78720.00

Handling Precautions

ParameterRatingStandard
ESD – Human Body Model (HBM)1AESDA / JEDEC JS-001-2017
ESD – Charged Device Model (CDM)C3JEDEC JESD22-C101F
MSL – Moisture Sensitivity LevelLevel 1IPC/JEDEC J-STD-020E

Caution: ESD-sensitive device. Proper handling procedures must be followed to avoid damage.

Solderability:

  • Compatible with lead-free soldering (max 260 °C reflow) and tin/lead soldering (max 245 °C reflow).
  • Soldering profiles available upon request.
  • Contact plating: Annealed matte tin.

RoHS Compliance:

  • Fully compliant with 2011/65/EU RoHS directive, as amended by 2015/863/EU.
  • Additional attributes: Lead-free Halogen-free (no Chlorine or Bromine) Antimony-free TBBP-A (C15H12Br402) free PFOS free SVHC free

Pad Descriptions


Pad No.LabelDescription
2RF InRF input, matched to 50 Ω. Requires an external DC block.
11RF Out / VDDRF output, matched to 50 Ω. Requires bias voltage and an external DC block.
All other pinsN/CNo internal connection. Provide grounded PCB pads for optimal isolation and secure mounting.
Backside PadRF/DC GNDRF/DC ground. Use the recommended via pattern to minimize inductance and thermal resistance. Refer to the PCB Mounting Pattern.

Ordering Information


Part NumberDescription
TQP3M90182500 units on a 7-inch reel
TQP3M9018-PCB_IFEvaluation board for 50–500 MHz range
TQP3M9018-PCB_RFEvaluation board for 0.5–4 GHz range

Absolute Maximum Ratings


ParameterRating
Storage Temperature−65 to +150 °C
RF Input Power (CW, 50 Ω, T=25 °C)+23 dBm
Supply Voltage (VDD)+7 V
Reverse Supply Voltage−0.3 V

Note: Exceeding one or more of these absolute maximum limits may result in permanent device damage.

Recommended Operating Conditions


ParameterMinTypMaxUnits
Supply Voltage (VDD)+3.0+5.0+5.25V
Case Temperature (TCASE)−40+105°C
Junction Temperature for >10⁶ hours MTTF (Tj)+190°C

Note: Electrical specifications are validated under defined test conditions. Performance is not guaranteed across all recommended operating conditions. Using the device outside these ranges may impact reliability and degrade performance.

Electrical Specifications
Test conditions (unless otherwise stated): VDD = +5 V, Temperature = +25 °C, 50 Ω system


ParameterConditionsMinTypMaxUnits
Operational Frequency Range204000MHz
Test Frequency1900MHz
Gain1920.522dB
Input Return Loss16dB
Output Return Loss19dB
Output P1dB+21dBm
Output IP3Pout = +3 dBm/tone, Δf = 1 MHz+33+37dBm
Noise Figure1.3dB
Current, IDD85100mA
Thermal Resistance, θJCJunction to case38.7°C/W

Evaluation Board – TQP3M9018-PCB_RF (500-4000 MHz)

Evaluation Board – TQP3M9018-PCB_RF (500-4000 MHz)

Evaluation Board – TQP3M9018-PCB_RF (500-4000 MHz)

Notes:

  1. Refer to the Evaluation Board PCB Information section for details on materials and stack-up.
  2. Components marked on the silkscreen but missing from the schematic are not populated.
  3. B1 (0 Ω jumper), though not shown in the schematic, may be substituted with a copper trace in the final application layout.
  4. Recommended component values vary depending on the operating frequency.
  5. Unless otherwise noted, all components are 0603 size.

Bill of Materials – TQP3M9018-PCB_RF (500–4000 MHz)


Reference DesignatorValueDescriptionManufacturer / Part Number
n/an/aPrinted Circuit BoardQorvo 1076342
U1n/aHigh Linearity LNA Gain BlockQorvo TQP3M9018
C2, C6100 pFCapacitor, 0603, 5%, 100 V, NPO/COGVarious
C10.01 µFCapacitor, 0603, 5%, 50 V, X7RVarious
L268 nHInductor, 0603, 5%Coilcraft 0603CS-68NXJL
B10 ΩResistor, 0603Various
L1, D1, C3, C4DNPNot populated

Notes:

  1. Performance can be fine-tuned for the desired frequency using the recommended component values listed below.
  2. Inductors are wirewound Coilcraft types.

Recommended Component Values by Frequency


Reference Designator50 MHz200 MHz500 MHz2000 MHz2500 MHz3500 MHz
C2, C60.01 µF1000 pF100 pF22 pF22 pF22 pF
L2470 nH220 nH82 nH22 nH18 nH15 nH

Typical Performance – TQP3M9018-PCB_RF
Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA (typical), Temperature = +25 °C


Parameter500 MHz900 MHz1900 MHz2700 MHz3500 MHz4000 MHzUnits
Gain22.421.920.519.518.217dB
Input Return Loss101116.630.512.78dB
Output Return Loss910191616.618dB
Output P1dB+21.4+21.4+21+20.2+19.8+19.2dBm
OIP3 (1)+38.4+37.5+37+35.3+34.7+34.4dBm
Noise Figure (2)1.11.11.31.622.5dB

Notes:

  1. OIP3 measured using two tones at +4 dBm per tone, separated by 1 MHz.
  2. Noise figure values include PCB losses (approximately 0.1 dB at 2 GHz).

Performance Plots – TQP3M9018-PCB_RF
Test conditions unless otherwise specified: VDD = +5 V, IDD = 85 mA (typical), Temperature = +25 °C

Performance Plots – TQP3M9018-PCB_RF

Performance Plots – TQP3M9018-PCB_RF

Performance Plots – TQP3M9018-PCB_RF
Test conditions unless otherwise noted: VDD=+5V, IDD=85 mA typ., Temp= +25°C

Performance Plots – TQP3M9018-PCB_RF

Performance Plots – TQP3M9018-PCB_RF


Conclusion

The TQP3M9018 is a high-linearity, low-noise gain block covering 20 MHz to 4 GHz, offering excellent gain, linearity, and low noise in a compact 16‑pin QFN package. Its wide frequency range, robust performance, and ease of integration make it ideal for wireless infrastructure, repeaters, and other high-performance transmitter and receiver applications.

Contact us today for a  TQP3M9018 quote!

Looking for a high-performance LNA gain block? The TQP3M9018 delivers wideband coverage from 20 MHz to 4 GHz, high gain, low noise, and excellent linearity—all in a compact 16‑pin QFN package. Perfect for wireless infrastructure, repeaters, and advanced RF systems.

Contact us today for a quote! Our team at JMBom will provide you with the best pricing and fastest response to meet your project needs.


Amanda Miller

Amanda Miller is a senior electronics engineer with 6 years of experience. She focuses on studying resistors, transistors, and package design in detail. Her deep knowledge helps her bring innovation and high standards to the electronics industry.

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