Axicom SMT Relays - Transportation, Storage, Handling, Assembly, and Testing

Overview

This application note provides guidelines for the proper handling of Axicom SMT relays to ensure their performance and reliability throughout their lifecycle.

Transportation

• Avoid Excessive Shock and Vibration: Mechanical stress can alter operating characteristics or cause internal damage.
• Check for Damage: If mechanical stress is suspected, inspect and test the relays before use.

Packaging

• Standard Packing: SMT relays are typically packed in blisters on a reel (tape & reel) and dry packed to prevent exposure to humidity.
• Storage in Pizza Boxes: Relays should be stored in “Pizza Boxes” equipped with shock absorbers to protect from mechanical impacts.

Handling

• Careful Handling: Modern relays are sensitive to mechanical stress. Avoid dropping relays and ensure proper handling during all production stages.
• Splicing Reels: Ensure the loose end of the tape is not dropped and relay terminals are not bent.

Storage

• Clean Environment: Store relays within specified temperature limits in a clean area.
• Humidity Control: Extreme humidity and condensation can cause corrosion. Axicom SMD relays are dry packed to prevent this.
• Moisture Sensitive Level (MSL): MSL3 indicates that parts must be soldered within 168 hours of opening the bag. Remaining relays should be re-packed in a dry environment.

Testing

• Avoid Bending Terminals: During incoming inspection, take care not to bend relay terminals to prevent internal failure or degradation of sealing properties.

Automatic Handling

• Adjust Pressure: Ensure automatic feeders or robots are adjusted to avoid mechanical damage.
• Clamping Force: Clamping force should not exceed 5N in any direction (x, y, z) to maintain relay functionality.

Manual Handling

• Avoid Dropping: Do not drop relays into bins or on hard surfaces. Pick them directly from the tube to prevent bent terminals and mechanical shock.

Insertion

• Avoid Excessive Force: Do not press or use undue force on pins during insertion to maintain pin seal and coil connection integrity.

Clinching

• Avoid Bending Pins: Do not bend or cut pins after insertion to avoid compromising relay sealing and performance.

Fluxing

• Careful Flux Application: Unsealed relays should be hand soldered to avoid flux contamination. Flux should be used sparingly and evenly.

Preheating

• Preheat PCB: Preheat the entire PCB at 100°C for approximately 1 minute to dry the flux and prevent penetration during soldering.

SMT Soldering

• Lower Process Limits: Solder at lower process limits. Follow the soldering profile mentioned in the respective part’s datasheet.

Wave Soldering

• Controlled Process: Ensure the solder bath temperature does not exceed 265°C and soldering time is within 5 seconds.

Hand Soldering

• Quick Process: Complete hand soldering quickly with a tip temperature of 300°C and soldering time not exceeding 3 seconds.

Chemical Cleaning

• Avoid Contamination: Take precautions to prevent solvent penetration into unsealed relays. Use suitable solvents like isopropyl alcohol and avoid ultrasonic cleaning.

Coating

• Suitable Coatings: Only relays that are at least wash tight (RTIII) can be coated. Avoid silicone coatings.