Samsung CL05A105KP5NNNC

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  • Part Number:

    CL05A105KP5NNNC

  • Manufacturer:

    Samsung

  • Category:

    Ceramic Capacitors

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf CL05A105KP5NNNC_Datesheet

  • Description:

    CAP CER 1UF 10V X5R 0402

  • In stock 1,373,509

    Min: 1Mult: 1

  • Unit Price: $Subtotal: $

" Not available to buy online? Want the lower wholesale price? Please send RFQ, we will respond immediately
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Specifications
Type
Paramete
Type
Paramete
Applications
General Purpose
Features
-
Ratings
-
Tolerance
±10%
Mounting Type
Surface Mount, MLCC
Height - Seated (Max)
-
Failure Rate
-
Operating Temperature
-55°C ~ 85°C
Lead Style
-
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Voltage - Rated
10V
Lead Spacing
-
Package / Case
0402 (1005 Metric)
Thickness (Max)
0.022" (0.55mm)
Capacitance
1 µF
Temperature Coefficient
X5R
Overview

1. Product Identification:

  • Supplier: Samsung Electro-Mechanics
  • Part Number: CL05A105KP5NNNC
  • Description: CAP, 1µF, 10V, ±10%, X5R, 0402

2. Detailed Specifications:

  • Series: Samsung Multi-layer Ceramic Capacitor
  • Size: 0402 (inch code)
  • Dielectric: X5R
  • Capacitance: 1µF
  • Tolerance: ±10% Plating (Pb Free)
  • Rated Voltage: 10V
  • Thickness: 0.50±0.05mm
  • Packaging: Cardboard Type, 7" Reel

3. Reliability Test and Judgement Conditions:

  • Capacitance: Within specified tolerance 1µF±10% / 1.0±0.2Vrms
  • Tan δ (DF): 0.2 max.
  • Insulation Resistance: 1,000Mohm or 25Mohm×µF
  • Appearance: No abnormal exterior appearance (Microscope ×10)
  • Withstanding Voltage: No dielectric breakdown or mechanical breakdown at 250% of the rated voltage
  • Temperature Characteristics: Capacitance change should be within ±15% from -55°C to 85°C
  • Adhesive Strength of Termination: No peeling shall occur on the terminal electrode
  • Bending Strength: Capacitance change within ±10% with 1.0mm/sec. bending to the limit (1mm)
  • Solderability: SnAg3.0Cu0.5 solder is to be soldered at 245±5°C, 3±0.3sec. (preheating: 80~120°C for 10~30sec.)
  • Resistance to Solder Heat: Tan δ, IR should be the same as the initial spec. after pot testing at 270±5°C, 10±1sec.

4. Recommended Soldering Method:

  • Reflow Soldering: Reflow Peak Temperature 260±5°C, 30sec.

5. Packaging Details:

  • Type: 7 inches reel
  • Pitch: 4mm
  • Plastic: 20K/50K

6. Storage and Handling:

  • Storage Conditions: Temperature 0~40°C, Humidity 0~70% RH
  • Shelf Life: 6 months from the outgoing date of delivery, check solderability before use if stored over 6 months.
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