Samsung CL05A226MQ5QUNC

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  • Part Number:

    CL05A226MQ5QUNC

  • Manufacturer:

    Samsung

  • Category:

    Aluminum - Polymer Capacitors

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf CL05A226MQ5QUNC_Datesheet

  • Description:

    CAP CER 22UF 6.3V X5R 0402

  • In stock 1,006,944

    Min: 1Mult: 1

  • Unit Price: $Subtotal: $

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Specifications
Type
Paramete
Type
Paramete
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Capacitance
22 µF
Failure Rate
-
Package / Case
0402 (1005 Metric)
Features
-
Lead Style
-
Operating Temperature
-55°C ~ 85°C
Lead Spacing
-
Applications
General Purpose
Thickness (Max)
0.028" (0.70mm)
Mounting Type
Surface Mount, MLCC
Temperature Coefficient
X5R
Voltage - Rated
6.3V
Height - Seated (Max)
-
Tolerance
±20%
Ratings
-
Overview

CL05A226MQ5QUNC Datasheet Summary

Basic Information

  • Manufacturer: Samsung Electro-Mechanics
  • Part Number: CL05A226MQ5QUNC
  • Description: Multi-layer Ceramic Capacitor, 0402 Size, 22 µF, 6.3 V, ±20% Tolerance, X5R Temperature Characteristic

Detailed Specifications

Capacitance and Voltage

  • Nominal Capacitance: 22 µF
  • Capacitance Tolerance: ±20%
  • Rated Voltage: 6.3 V

Temperature Characteristics

  • Temperature Characteristic: X5R
  • Operating Temperature Range: -55°C to +85°C
  • Capacitance Change: ±15% over the operating temperature range

Dimensions

  • Package Size: 0402 (1.0 mm x 0.5 mm)
  • Length (L): 1.0 mm ± 0.2 mm
  • Width (W): 0.5 mm ± 0.2 mm
  • Height (T): 0.5 mm ± 0.2 mm

Packaging

  • Packaging Type: Cardboard Type, 7" Reel

Electrical Characteristics

  • Insulation Resistance (I.R.): 10,000 MΩ or 10 MΩ·F (whichever is smaller)
  • Dissipation Factor (Tan δ): ≤ 0.15
  • Withstanding Voltage: 250% of rated voltage for 60 to 120 seconds

Mechanical and Environmental

  • Adhesive Strength of Termination: No peeling shall occur under 500 g·f for 10±1 seconds
  • Bending Strength: Capacitance change within ±12.5% when bent to the limit (1 mm) at 1.0 mm/sec
  • Solderability: More than 75% of the terminal surface to be soldered with SnAg3.0Cu0.5 solder at 245±5°C for 3±0.3 seconds (preheating: 80~120°C for 10~30 seconds)
  • Resistance to Soldering Heat: Capacitance change within ±15%, Tan δ and I.R. to meet initial specifications
  • Vibration Test: Capacitance change within ±5%, amplitude 1.5 mm, 2 hours in each of the three directions (x, y, z)
  • Moisture Resistance: Capacitance change within ±12.5%, Tan δ ≤ 0.25, I.R. ≥ 500 MΩ or 1 MΩ·F (whichever is smaller), 40±2°C, 90~95% RH, 500+12/-0 hours
  • High Temperature Resistance: Capacitance change within ±12.5%, Tan δ ≤ 0.25, I.R. ≥ 1,000 MΩ or 2 MΩ·F (whichever is smaller), max. operating temperature, 1,000+48/-0 hours
  • Temperature Cycling: Capacitance change within ±15%, Tan δ and I.R. to meet initial specifications, min. operating temperature → 25°C → max. operating temperature → 25°C, 5 cycle test

Recommended Soldering Method

  • Reflow Soldering: Peak Temperature 260±5°C, 30 seconds

Notes

  • Product Specifications: Effective as of March 1, 2014. Subject to change without notice. Please approve product specifications before placing an order.
  • Contact Information: For any questions regarding the product specifications, please contact Samsung sales personnel or application engineers.
  • Test Condition: Capacitance is measured after heat treatment at 150°C ± 10°C for 1 hour and maintained in ambient air for 24 ± 2 hours.
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