Samsung CL10A106MO8NQNC

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  • Part Number:

    CL10A106MO8NQNC

  • Manufacturer:

    Samsung

  • Category:

    Aluminum - Polymer Capacitors

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf CL10A106MO8NQNC_Datesheet

  • Description:

    CAP CER 10UF 16V X5R 0603

  • In stock 176,017

    Min: 1Mult: 1

  • Unit Price: $Subtotal: $

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Specifications
Type
Paramete
Type
Paramete
Lead Spacing
-
Ratings
-
Package / Case
0603 (1608 Metric)
Temperature Coefficient
X5R
Height - Seated (Max)
-
Operating Temperature
-55°C ~ 85°C
Capacitance
10 µF
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Tolerance
±20%
Features
-
Thickness (Max)
0.035" (0.90mm)
Applications
General Purpose
Voltage - Rated
16V
Lead Style
-
Mounting Type
Surface Mount, MLCC
Failure Rate
-
Overview

CL10A106MO8NQNC Specification Summary

Product Information

  • Supplier: Samsung Electro-Mechanics
  • Samsung Part Number: CL10A106MO8NQNC
  • Product Type: Multi-layer Ceramic Capacitor
  • Description: CAP, 10µF, 16V, ±20%, X5R, 0603

Detailed Specifications

1. Part Number Breakdown

  • CL10: Series code for Samsung Multi-layer Ceramic Capacitor
  • A106: Capacitance code (10µF)
  • M: Capacitance tolerance (±20%)
  • O8: Size control code
  • NQNC: Packaging code (Cardboard Type, 7" reel)

2. Type & Dimensions

  • Size Code: 0603 (inch code)
  • Dimensions:Length (L): 1.60 ± 0.15 mmWidth (W): 0.80 ± 0.15 mmThickness (T): 0.80 ± 0.15 mm

3. Rated Value

  • Rated Voltage: 16V
  • Nominal Capacitance: 10µF
  • Capacitance Tolerance: ±20%
  • Temperature Characteristic: X5R

4. Reliability Tests

  • Capacitance Tolerance: Within specified tolerance
  • Dissipation Factor (DF): 0.1 max.
  • Insulation Resistance (IR): 10,000Mohm or 100Mohm×µF (whichever is smaller)
  • Appearance: No abnormal exterior appearance (Microscope ×10)
  • Withstanding Voltage: No dielectric breakdown or mechanical breakdown at 250% of the rated voltage
  • Temperature Characteristics: Capacitance change within ±15% from -55°C to 85°C
  • Adhesive Strength: No peeling shall occur on the terminal electrode
  • Bending Strength: Capacitance change within ±12.5% with 1.0mm/sec bending to the limit (1mm)
  • Solderability: More than 75% of terminal surface, SnAg3.0Cu0.5 solder, 245±5℃, 3±0.3sec. (preheating: 80~120℃ for 10~30sec.)
  • Resistance to Soldering Heat: Capacitance change within ±7.5%, Solder pot: 270±5℃, 10±1sec.
  • Vibration Test: Capacitance change within ±5%, Amplitude: 1.5mm, 2 hours × 3 directions (x, y, z)
  • Moisture Resistance: Capacitance change within ±12.5%, 40±2℃, 90~95% RH, 500+12/-0 hours
  • High Temperature Resistance: Capacitance change within ±12.5%, Max. operating temperature 1000+48/-0 hours
  • Temperature Cycling: 5 cycle test, Min. operating temperature → 25°C → Max. operating temperature → 25°C

5. Recommended Soldering Method

  • Reflow Soldering: Peak Temperature 260±5℃, 10sec. Max

Additional Notes

  • Data Disclaimer: The product specifications included in this document are effective as of March 1, 2013. They are standard product specifications for reference only. Samsung may change, modify, or discontinue the product specifications without notice at any time. Therefore, you need to approve the product specifications before placing an order.
  • Contact Information: For any questions regarding the product specifications, please contact Samsung sales personnel or application engineers.
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