Samsung CL10B105KB8NQNC

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  • Part Number:

    CL10B105KB8NQNC

  • Manufacturer:

    Samsung

  • Category:

    Aluminum - Polymer Capacitors

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

  • Description:

    1µF Ceramic Capacitor ±10%

  • In stock 12,205

    Min: 1Mult: 1

  • Unit Price: $Subtotal: $

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Overview

Product Specification: CL10B105KB8NQNC

Supplier Information

  • Supplier: Samsung Electro-Mechanics
  • Samsung P/N: CL10B105KB8NQNC

Product Description

  • Product Type: Multi-Layer Ceramic Capacitor
  • Description: CAP, 105K, 10㎌, 50V, ±10%, X7R, 1206

Qualifications

  • AEC-Q200 Qualified: Yes

Dimensional Information

  • Size Code: 1206
  • Dimensions:Length (L): 3.20 ± 0.20 mmWidth (W): 1.60 ± 0.20 mmThickness (T): 1.25 ± 0.25 mm

Part Number Breakdown

  • CL 10 B K B 8 N Q N C① Series: Samsung Multi-Layer Ceramic Capacitor② Size (inch code): 1206③ Dielectric: X7R④ Capacitance: 105K (10㎌)⑤ Tolerance: ±10%⑥ Rated Voltage: 50V⑦ Thickness: 1.25 ± 0.25 mm⑧ Inner Electrode: Ni⑨ Termination Metal: Sn (100% Pb Free)⑩ Packaging: Embossed Type, 7" Reel / Quantity: 2K

Reliability Test and Judgement Conditions

  • High Temperature Exposure:Unpowered, 1000 hours @ Max. TemperatureAppearance: No abnormal exterior appearanceCapacitance Change: Within ±10% of Initial MeasurementTan δ: 15.0% max.IR: More than 10000㏁ or 50㏁·㎌, whichever is smaller
  • Temperature Cycling:1000 CyclesAppearance: No abnormal exterior appearanceCapacitance Change: Within ±10% of Initial MeasurementTan δ: 15.0% max.IR: More than 10000㏁ or 50㏁·㎌, whichever is smaller1 cycle condition: -55+0/-3℃ (30±3min) → Room Temp. (1min) → 125+3/-0℃ (30±3min) → Room Temp. (1min)
  • Destructive Physical Analysis:No Defects or abnormalities per EIA 469
  • Humidity Bias:1000 hours at 85℃/85% RH, Rated Voltage and 1.3~1.5VAppearance: No abnormal exterior appearanceCapacitance Change: Within ±12.5% of Initial MeasurementTan δ: 15.0% max.IR: More than 500㏁ or 5㏁·㎌, whichever is smaller
  • High Temperature Operating Life:1000 hours @ 125℃, 150% Rated VoltageAppearance: No abnormal exterior appearanceCapacitance Change: Within ±12.5% of Initial MeasurementTan δ: 15.0% max.IR: More than 1000㏁ or 5㏁·㎌, whichever is smaller

Performance Test Conditions

  • External Visual: No abnormal exterior appearance
  • Physical Dimension: Within specified dimensions
  • Mechanical Shock:Appearance: No abnormal exterior appearanceCapacitance Change: Within ±10%Tan δ: 12.5% max.IR: More than 10000㏁ or 50㏁·㎌, whichever is smaller
  • Vibration:Appearance: No abnormal exterior appearanceCapacitance Change: Within ±10%Tan δ: 12.5% max.IR: More than 10000㏁ or 50㏁·㎌, whichever is smaller
  • Resistance to Solder Heat:Appearance: No abnormal exterior appearanceCapacitance Change: Within ±10%Tan δ: 12.5% max.IR: More than 10000㏁ or 50㏁·㎌, whichever is smaller
  • ESD:Appearance: No abnormal exterior appearanceCapacitance Change: Within ±10%Tan δ: 12.5% max.IR: More than 10000㏁ or 50㏁·㎌, whichever is smaller
  • Solderability:95% of the terminations should be soldered evenly and continuouslyPreheat at 155℃ for 4 hours, immerse in solder for 5s at 245±5℃Steam aging for 8 hours, immerse in solder for 5s at 245±5℃Steam aging for 8 hours, immerse in solder for 120s at 260±5℃

Recommended Soldering Method

  • Reflow Soldering:Reflow Peak Temperature: 260 +0/-5℃Duration: 30sec. MaxMeets IPC/JEDEC J-STD-020 D Standard

Recommended TEST PCB

  • Adhesive Strength of Termination:Size Code: 1206Size (mm): 3.2 × 1.6a: 1.40 mmb: 2.20 mmc: 2.00 mm
  • Bending Strength Test Substrate:Size Code: 1206Size (mm): 3.2 × 1.6a: 1.40 mmb: 2.20 mmc: 2.00 mmd: 5.0 mme: 5.5 mm
  • Material: Glass epoxy substrate
  • Thickness: T=1.6 mm (T=0.8 mm for 03/05)
  • Copper foil: T=0.035 mm
  • Solder resist: Present

Packaging

  • Type: Embossed Type
  • Reel Size: 7 inches
  • Quantity: 2K

Storage and Handling

  • Storage Environment:Temperature: 0~40°CHumidity: 0~70% RHShelf Life: 6 months from the outgoing date of delivery
  • Caution for Corrosive Environment:Store MLCC in an environment without corrosive gases
  • Transportation:Protect from excessive temperature, humidity, and mechanical forceAvoid excessive vibrations, shocks, or external forces

Disclaimer & Limitation of Use and Application

  • The products listed in this Specification sheet are NOT designed and manufactured for high reliability applications such as aerospace, medical, military, disaster prevention, power plant control, atomic energy-related equipment, undersea equipment, traffic signal equipment, data-processing equipment, electric heating apparatus, burning equipment, safety equipment, or any other applications with similar complexity or reliability requirements.
  • Misuse of the products deviating from the product specifications or information provided in this Spec sheet may cause serious property damages or personal injury.
  • We will NOT be liable for any damages resulting from any misuse of the products.
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