CL21B334KBFNNNE Multilayer Ceramic Capacitor Specification Summary

Basic Information

• Supplier: Samsung Electro-Mechanics
• Samsung Part Number: CL21B334KBFNNNE
• Product: Multi-layer Ceramic Capacitor
• Description: CAP, 330㎋, 50V, ±10%, X7R, 0805

Part Number Breakdown

• Series: Samsung Multi-layer Ceramic Capacitor
• Size: 0805 (inch code), Dimensions: L : 2.00±0.10㎜, W : 1.25±0.10㎜
• Dielectric: X7R
• Capacitance: 330㎋
• Capacitance Tolerance: ±10%
• Rated Voltage: 50V
• Thickness: 1.25±0.10㎜
• Termination: Ni/Sn, 100% Pb Free
• Packaging: Embossed Type, 7" Reel

Reliability Test and Judgement Conditions

• Capacitance: Within specified tolerance 1±10% / 1.0±0.2Vrms
• Tan δ (DF): 0.05 max.
• Insulation Resistance: Whichever is smaller, 1,000Mohm or 50Mohm×㎌
• Appearance: No abnormal exterior appearance under Microscope (×10)
• Withstanding Voltage: No dielectric breakdown or mechanical breakdown at 250% of the rated voltage
• Temperature Characteristics: Adhere to specified conditions
• Adhesive Strength: No peeling on the terminal electrode
• Bending Strength: Adhere to specified conditions
• Solderability: Soldered with SnAg3.0Cu0.5 solder at 245±5℃, 3±0.3sec. (preheating: 80~120℃ for 10~30sec.), Resistance to Solder pot: 270±5℃, 10±1sec.
• Vibration Test: Amplitude: 1.5mm, From 10Hz to 55Hz (return: 1min.), 2hours × 3 directions (x, y, z)
• Moisture Resistance: With rated voltage, Whichever is smaller, 1,000+48/-0hrs, 1 cycle condition
• High Temperature Resistance: Max. operating temperature, Whichever is smaller, 1 cycle condition, Min. operating temperature → 25℃ → Max. operating temperature → 25℃, 5 cycle test

Recommended Soldering Method

• Reflow Soldering: Reflow Peak Temperature: 260±5℃, 30sec.

Additional Notes

• The product specifications are effective as of March 1, 2013, and are provided for reference only. They may be subject to change, modification, or discontinuation without notice. Approval of the product specifications is required before placing an order.