CL32B106KBJNNNE Datasheet Summary

Basic Information

• Manufacturer: Samsung Electro-Mechanics
• Part Number: CL32B106KBJNNNE
• Description: Multi-layer Ceramic Capacitor, 1210 Size, 10 µF, 50 V, ±10% Tolerance, X7R Temperature Characteristic

Detailed Specifications

Capacitance and Voltage

• Nominal Capacitance: 10 µF
• Capacitance Tolerance: ±10%
• Rated Voltage: 50 V

Temperature Characteristics

• Temperature Characteristic: X7R
• Operating Temperature Range: -55°C to +125°C
• Capacitance Change: ±15% over the operating temperature range

Dimensions

• Package Size: 1210 (3.2 mm x 1.25 mm)
• Length (L): 3.2 mm ± 0.3 mm
• Width (W): 1.25 mm ± 0.2 mm
• Height (T): 2.5 mm ± 0.2 mm

Packaging

• Packaging Type: Embossed Type, 7" Reel

Electrical Characteristics

• Insulation Resistance (I.R.): 10,000 MΩ or 100 MΩ·F (whichever is smaller)
• Dissipation Factor (Tan δ): ≤ 0.1
• Withstanding Voltage: 250% of rated voltage for 60 to 120 seconds

Mechanical and Environmental

• Adhesive Strength of Termination: No peeling shall occur under 500 g·f for 10±1 seconds
• Bending Strength: Capacitance change within ±12.5% when bent to the limit (1 mm) at 1.0 mm/sec
• Solderability: More than 75% of the terminal surface to be soldered with SnAg3.0Cu0.5 solder at 245±5°C for 3±0.3 seconds (preheating: 80~120°C for 10~30 seconds)
• Resistance to Soldering Heat: Capacitance change within ±7.5%, Tan δ and I.R. to meet initial specifications
• Vibration Test: Capacitance change within ±5%, amplitude 1.5 mm, 2 hours in each of the three directions (x, y, z)
• Moisture Resistance: Capacitance change within ±12.5%, Tan δ ≤ 0.125, I.R. ≥ 12.5 MΩ·F, 40±2°C, 90~95% RH, 500+12/-0 hours
• High Temperature Resistance: Capacitance change within ±12.5%, Tan δ ≤ 0.125, I.R. ≥ 25 MΩ·F, max. operating temperature, 1,000+48/-0 hours
• Temperature Cycling: Capacitance change within ±7.5%, Tan δ and I.R. to meet initial specifications, min. operating temperature → 25°C → max. operating temperature → 25°C, 5 cycle test

Recommended Soldering Method

• Reflow Soldering: Peak Temperature 260±5°C, 10 seconds max

Notes

• Product Specifications: For more detailed specifications, please refer to the Samsung MLCC catalogue.
• Contact Information: For any questions regarding the product specifications, please contact Samsung sales personnel or application engineers.