CLP-105-02-L-DH-A
Low-Profile 0.050" Pitch Double-Row Socket Strip
Samtec CLP Series – Through-Hole Horizontal Mount

1. Ordering Code Break-down• CLP – Series identifier (low-profile .050" grid)• 105 – 5 positions per row (10 circuits total, 2 rows)• 02 – Surface-mount tail option (02 = SMT, blank = through-hole)• L – Plating code: 10 µ" (0.25 µm) selective GOLD on contact area, matte-tin on solder tail• DH – Double-row Horizontal body style• A – Alignment pin option: two molded plastic locating posts for automatic placement (available 4–50 pos)
2. Mechanical Details• Pitch: 0.050" × 0.050" (1.27 mm × 1.27 mm) double row• Overall body length: (No. of pos × 0.050") + 0.017" ±0.008"= (5 × 0.050") + 0.017" = 0.267" ±0.008" (6.78 mm ±0.20 mm)• Body width: 0.180" ±0.010" (4.57 mm ±0.25 mm)• Body height: 0.120" ref (3.05 mm) above board• Contact material: Phosphor bronze• Insulator: Black LCP, UL 94 V-0• Tail style: Surface-mount gull-wing, 0.025" (0.64 mm) nominal foot width• Lead finish: Light gold (10 µ") on contact fingers, matte-tin on tails (L-code)• Alignment pins: 0.042" (1.07 mm) diameter, 0.030" (0.76 mm) protrusion below body
3. Electrical & Performance• Current rating: 1 A per pin (standard Samtec rating for .050" micro strip)• Contact resistance: ≤ 20 mΩ initial• Dielectric withstanding voltage: 500 V rms (sea level)• Insulation resistance: ≥ 1000 MΩ @ 500 V• Durability: 200 mating cycles min (gold plating)• Operating temperature: –55 °C to +125 °C (LCP limit)
4. Packaging & Supply• Standard: tubes (DH-no-option)• Tape-and-reel: add –TR suffix; full-reel quantity add –FR (follow Samtec SPES calculator)• Tube quantity: 50 pieces per tube typical for 5-pos DH body• Reel diameter: 12" (330 mm) for –TR option
5. PCB Footprint (recommended)• Row spacing: 0.050" (1.27 mm) center-to-center• Pad pitch: 0.050"• Alignment-hole diameter: 0.045" (1.14 mm) for 0.042" pin• Keep-out zone: 0.060" (1.52 mm) minimum from body edge for pick-and-place clearance
6. Critical Quality Notes• First and last pin of each row flush to 0.003" (0.08 mm) below insulator body• Maximum sway of contacts: 0.002" (0.05 mm) either direction• Contact retention force: 1 lb (4.5 N) min• Cut flash: 0.015" max in non-critical areas; zero flash in contact zone• Tails sheared with burr ≤ 0.0045" (0.114 mm), oriented away from PCB
7. Typical Applications• Board-to-board parallel stacking (mated with Samtec SLP or SHF series shrouded headers)• High-density I/O on 1.27 mm grid (DSP, FPGA, RF modules)• Automated SMT placement with alignment pins for coplanarity < 0.10 mm
8. Ordering Example (complete)CLP-105-02-L-DH-A-TR = 5-pos/row, SMT tails, 10 µ" gold, horizontal body, alignment pins, tape & reel
9. Cautions• Do not scale dimensions from drawing – use Samtec Gerber/STEP file• ESD-sensitive contacts – handle in static-controlled environment• Alignment-pin option (-A) not engineered-approved for –02 & –03 position bodies; verify pick-and-place nozzle clearance