Samtec Inc. TSM-105-01-L-DV-P-TR

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  • Part Number:

    TSM-105-01-L-DV-P-TR

  • Manufacturer:

    Samtec Inc.

  • Category:

    Headers, Male Pins

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf TSM-105-01-L-DV-P-TR_Datesheet

  • Description:

    Connector Header Surface Mount 10 position 0.100" (2.54mm)

  • In stock 3,902
" Not available to buy online? Want the lower wholesale price? Please send RFQ, we will respond immediately
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Specifications
Type
Paramete
Type
Paramete
Mated Stacking Heights
-
Mfr
Samtec Inc.
Contact Finish Thickness - Post
-
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Length - Mating
0.230" (5.84mm)
Overall Contact Length
-
Contact Length - Post
-
Contact Shape
Square
Style
Board to Board or Cable
Insulation Color
Black
Number of Positions Loaded
All
Applications
-
Features
Pick and Place
Number of Positions
10
Operating Temperature
-55°C ~ 125°C
Current Rating (Amps)
-
Pitch - Mating
0.100" (2.54mm)
Ingress Protection
-
Connector Type
Header, Cuttable
Contact Finish - Mating
Gold
Material Flammability Rating
UL94 V-0
Contact Material
Phosphor Bronze
Contact Finish - Post
Tin
Voltage Rating
-
Insulation Height
0.100" (2.54mm)
Contact Type
Male Pin
Fastening Type
Push-Pull
Insulation Material
Liquid Crystal Polymer (LCP)
Mounting Type
Surface Mount
Number of Rows
2
Termination
Solder
Base Product Number
TSM-105
Row Spacing - Mating
0.100" (2.54mm)
Shrouding
Unshrouded
Overview

DESCRIPTION

· Confidential and proprietary document by Samtec, Inc.
· Contains design, manufacturing, and patent rights information.
· Unauthorized disclosure or reproduction prohibited.



FEATURES

· Multiple lead styles and plating specifications available.
· Options include locking clips, alignment pins, and pick and place pads.
· Tape and reel packaging for positions 02 through 28.
· Various mounting styles: DV, TV, TM.



APPLICATIONS

· Suitable for high-density connector applications.
· Ideal for use in electronic assemblies requiring precise placement.
· Compatible with manual and automated placement processes.



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