Samsung K4F6E3S4HB-KHCL02V Comprehensive Datasheet Summary

1. Basic Device Information

• Full Part Number: K4F6E3S4HB-KHCL02V
• Device Type: LPDDR4 SDRAM
• Organization: 16Gb ×32-bit
• Manufacturer: Samsung
• Package: FBGA-200
• Temperature Grade: Industrial / Extended automotive (−40 °C to +105 °C)
• Status: Active

2. Core Features

• Memory Density: 16Gb
• Data Bus Width: 32 bits
• Data Rate: 4266 Mbps
• Supply Voltage: Single 1.1 V core/VDDQ
• Temperature Range: −40 °C to +105 °C
• Package: FBGA-200 for compact, high‑reliability designs
• Low power: Optimized for mobile, automotive, and embedded systems
• High speed: Supports up to 4266 Mbps for high‑bandwidth applications

3. Key Electrical Specifications

• Operating Voltage (VDD/VDDQ): 1.1 V
• Data Transfer Rate: 4266 Mbps
• Operating Temperature (TC): −40 °C ≤ TC ≤ +105 °C
• Package: FBGA‑200
• Memory Type: DRAM
• Memory Architecture: LPDDR4

4. Pin & Package Overview

• Package: FBGA-200
• Pin Count: 200 pins
• Typical Use: Space‑constrained embedded, automotive, mobile, and industrial systems
• Mechanical: Compact form factor for high‑density PCB layout

5. Functional Summary

• Architecture: LPDDR4 standard compliant
• Bandwidth: Up to 4266 Mbps for high‑performance data processing
• Power Efficiency: Low‑voltage 1.1 V operation for extended battery life
• Reliability: Wide temperature range for harsh environments
• Application Optimized: Mobile devices, automotive systems, industrial controllers, tablets, smartphones

6. Target Applications

• Automotive infotainment & ADAS
• Industrial embedded systems
• High‑end smartphones & tablets
• Portable computing & IoT gateways
• High‑bandwidth embedded platforms

7. Ordering & Identification

• Part Number: K4F6E3S4HB-KHCL02V
• Marking: Samsung logo + part number
• Compliance: RoHS, automotive/industrial qualified