SKHUAME010 Model Information

Product Number

• SKHUAME010

General Information

• Document No.: KHU-703
• Title: Product Specifications
• Date: July 2017
• Company: ALPS ELECTRIC CO., LTD.

General Description

• Application: TACT switches without keytops.
• Operating Temperature Range: -40°C to 85°C (normal humidity, normal air pressure)
• Storage Temperature Range: -40°C to 90°C (normal humidity, normal air pressure)
• Test Conditions:Normal temperature: 5°C to 35°CNormal humidity: 25% to 85% RHNormal air pressure: 86 to 106 kPa

Appearance, Style, and Dimensions

• Appearance: No defects that affect the serviceability of the product.
• Style and Dimensions: Refer to the assembly drawings.

Type of Actuating

• Tactile Feedback: Tactile feedback

Contact Arrangement

• Circuit Form: 1 pole, 1 throw, 1 circuit, 1 contact
• Details: Refer to the assembly drawings.

Ratings

• Maximum Ratings: 12 VDC, 50 mA
• Minimum Ratings: 1 VDC, 10 µA

Electrical Specifications

• Contact Resistance:Applied static load: 5.1 NMeasuring method: 1 kHz small-current contact resistance meter or voltage drop method at 5VDC 10mACriterion: 100 mΩ Max.
• Insulation Resistance:Test voltage: 100 VDC for 1 minApplied position: Between all terminals and between terminals and ground (frame)Criterion: 100 MΩ Min.
• Voltage Proof:Test voltage: 250 VAC (50-60 Hz)Duration: 1 minApplied position: Between all terminals and between terminals and ground (frame)Criterion: No breakdown
• Bounce:Test method: Lightly striking the center of the stem at a rate of 3 to 4 operations per secondCriterion: ON bounce: 10 ms Max., OFF bounce: 10 ms Max.

Mechanical Specifications

• Operating Force:Measurement method: Vertical switch operation, gradually increasing loadCriterion: 2.55 ± 0.69 N
• Travel:Measurement method: Vertical switch operation, applied static load of 5.1 NCriterion: 0.25 +0.2/-0.1 mm
• Return Force:Measurement method: Vertical switch operation, measuring force to return to free positionCriterion: 0.49 N Min.
• Stop Strength:Measurement method: Vertical switch operation, applied static load of 29.4 N for 3 sCriterion: No mechanical or electrical damage
• Stem Strength:Measurement method: Maximum force to withstand a pull opposite to the direction of stem operationCriterion: 4.9 N

Environmental Specifications

• Low Temperature Resistance:Temperature: -40 ± 2°CDuration: 96 hCriterion: Refer to Items 6, 7.1, 7.2
• Heat Resistance:Temperature: 90 ± 2°CDuration: 96 hCriterion: Refer to Items 6, 7.1, 7.2
• Moisture Resistance:Temperature: 60 ± 2°CDuration: 96 hRelative humidity: 90% to 95%Criterion: Contact resistance: 500 mΩ Max., Insulation resistance: 10 MΩ Min., Refer to Items 6.3, 6.4, 7.1, 7.2
• Temperature Cycling:Cycles: 5 cyclesTemperature range: +90°C to -40°CCriterion: Refer to Items 6, 7.1, 7.2

Endurance Specifications

• Operating Life:Test conditions: 5 VDC, 5 mA resistive load, 2 to 3 operations per second, 3.23 N depression, 100,000 cyclesCriterion: Contact resistance: 1000 mΩ Max., Insulation resistance: 10 MΩ Min., Bounce: ON bounce: 20 ms Max., OFF bounce: 20 ms Max., Operating force: -30% to +30% of initial force
• Vibration Resistance:Test conditions: 10 to 55 Hz, 1.5 mm total amplitude, logarithmic or uniform sweep, 2 h each direction (6 h total)Criterion: Refer to Items 6, 7.1, 7.2
• Shock Resistance:Test conditions: 784 m/s² acceleration, 6 directions, 3 times per direction (18 times total)Criterion: Refer to Items 6, 7.1, 7.2

Soldering Conditions

• Hand Soldering:Soldering temperature: 350°C Max.Continuous soldering time: 3 s Max.Soldering iron capacity: 60 W Max.No excessive pressure on terminalsProtect switch assembly from flux penetration
• Reflow Soldering:Profile: Refer to documentAllowable soldering time: 2 times Max.Temperature should return to normal before second exposure
• Other Precautions:Ensure no flux on switch terminals and PCB before solderingDo not clean switch with solvent after solderingRecommended cream solder: M705-GRN360-K2 (SENJU METAL INDUSTRY CO., LTD) or equivalentAvoid through holes adjacent to switch mounted areaEnsure correct reflow conditionsPerform reflow soldering within recommended conditionsProtect switch assembly from flux penetration

Precautions in Use

• General:Designed for general electronic devices. For more sophisticated equipment, verify suitability.Designed for DC resistance load. Consult for other types of resistance.
• Soldering and Assembly:Avoid deformation and electrical performance issues during soldering.Confirm soldering conditions under actual production conditions.Handle with care to avoid damage to switch functions.Avoid auto dip soldering after mounting.Use vacuum on the "escape part of the frame" for chip mounting.Perform reflow soldering within recommended conditions.
• Washing Process:Do not clean the switch with solvent after soldering.
• Mechanism Design:Refer to engineering drawings for mounting hole and pattern dimensions.Avoid through holes under and around the switch.Avoid side stress on the stem.Press the center of the stem for consistent click feel.Avoid using the switch for mechanical detection functions.Do not apply stress beyond specified limits.
• Using Environment:Protect against dust and foreign matter.Avoid using in environments with sulfide gas or exhaust fumes.Use materials that do not generate sulfurization or oxidation gases.Avoid high humidity or dewing environments.
• Storage Method:Store in a cool, dry place away from direct sunlight and corrosive gases.Use within six months.Store remaining switches in a plastic bag after opening the seal.Avoid stacking too many switches.
• Others:Specification is valid for one year from issuance.Non-electrical and non-mechanical characteristics may change without notice.Do not use beyond the rating to avoid fire hazards.Ensure fail-safe design for higher safety level products.