DESCRIPTION

· DDR2 SDRAM with configurations: 512 Meg x 4, 256 Meg x 8, 128 Meg x 16

· Available in various FBGA packages: 60-ball and 84-ball options

· Supports industrial temperature range: -40°C to +95°C

· RoHS-compliant and available in Pb-free and Lead solder packages

FEATURES

· Operates at 1.8V ±0.1V with JEDEC-standard 1.8V I/O

· 4 n-bit prefetch architecture and 8 internal banks for concurrent operation

· Programmable CAS latency, burst lengths, and data-output drive strength

· On-die termination (ODT) and differential data strobe (DQS, DQS#)

· DLL aligns DQ and DQS transitions with CK

· 64ms, 8192-cycle refresh and supports JEDEC clock jitter specification

APPLICATIONS

· Suitable for high-performance computing and memory-intensive applications

· Ideal for industrial environments requiring robust temperature tolerance

· Used in systems requiring low power consumption and high-speed data transfer

· Applicable in consumer electronics, networking, and embedded systems