Micron Technology Inc. MT53E1536M32D4DE-046 AIT:B

View All Memory by Micron Technology Inc.

Part Number:
MT53E1536M32D4DE-046 AIT:B
Manufacturer:
Micron Technology Inc.
Category:
Memory
RoHs:
Non-RoHS Compliant
Datasheet:
Description:
SDRAM - Mobile LPDDR4X Memory IC 48Gbit Parallel 2.133 GHz 3.5 ns 200-TFBGA (10x14.5)
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Overview

Micron MT53E1536M32D4DE-046 AIT:B Technical Specification Summary

1. Basic Part Identification

Full Part Number: MT53E1536M32D4DE-046 AIT:B
Manufacturer: Micron Technology, Inc.
Product Family: Mobile LPDDR4 / LPDDR4X SDRAMMicron Technology
Device Type: Low-Power Double Data Rate 4 Synchronous DRAM
Marking Code: AIT:B (Revision/Trace Code)Micron Technology

2. Density & Memory Organization

Total Density: 48 Gb (Gigabits) / 6 GB (Gigabytes)
Organization: 1536M x 32 bits (1.5G x 32)
Channel Configuration: Dual-channel (2 channels × 16 I/O)Micron Technology
Bank Configuration: 8 internal banks per channelMicron Technology
Die Configuration: D4 – Quad-die package (768M x 16 × 4 dies)Micron Technology

3. Speed Grade & Timing Parameters

Speed Grade: -046
Clock Frequency (fCK): 2133 MHz
Data Rate: 4266 Mbps per pin (DDR)
Cycle Time (tCK): 0.468 ns (468 ps)
Timing Compliance: JEDEC JESD209-4 (LPDDR4) Standard

4. Voltage & Power Specifications

Core Voltage (VDD1): 1.8V (1.70V – 1.95V)Micron Technology
Secondary Voltage (VDD2): 1.1V (1.06V – 1.17V)Micron Technology
I/O Voltage (VDDQ): Dual-mode (1.1V or 0.6V LPDDR4X)Micron Technology
Power Management:

5. Package & Physical Specifications

Package Type: 200-ball TFBGA (Thin Fine-Pitch Ball Grid Array)
Package Dimensions: 10 mm × 14.5 mm × 0.73 mm
Mounting: Surface Mount (SMD/SMT)
Moisture Sensitivity Level (MSL): MSL 3 (168 hours)
RoHS Compliant: Yes, Halogen-free

6. Operating Temperature & Grading

Temperature Code: AITMicron Technology
Operating Temperature Range: -40°C to +105°C

7. Key Features

High-Speed Interface: 32-bit wide data bus, differential DQS data strobesMicron Technology
On-Chip Features:
Reliability:

8. Marking Code (AIT:B) Explanation

A: Automotive qualification (AEC-Q100)Micron Technology
I: Industrial temperature rangeMicron Technology
T: Package-level burn-inMicron Technology
:B: Specific device revision / manufacturing lot trace codeMicron Technology

9. Target Applications

Automotive infotainment & ADAS systems
High-end mobile & embedded systems
Industrial control & IoT gateways
Portable computing & communication devices
Automotive telematics

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