Micron MTFC8GAMALBH‑AIT Full Specification Summary

1. Basic Device Information

• Full Part Number: MTFC8GAMALBH‑AIT
• Device Type: Automotive‑grade e·MMC managed NAND flash memory
• Capacity: 8GB
• Interface Standard: e·MMC 5.1 (JEDEC JESD84‑B51)
• NAND Architecture: MLC NAND + integrated MMC controller
• Package: 153‑ball TFBGA (Package code: BH)
• Dimensions: 11.5 mm × 13.0 mm × 1.1 mm
• Temperature Grade: AIT (Automotive Industrial Temperature)
• Revision: Rev. J (December 2021)
• Qualification: AEC‑Q104 compliant; PPAP support
• Data Retention: AEC‑Q100‑005 compliant
• RoHS Compliant: Yes (lead‑free, halogen‑free available)

2. Core Features

• On‑chip controller manages ECC, wear leveling, bad block replacement
• Supports HS400, HS200, DDR52 modes
• Data bus width: 1‑bit, 4‑bit, 8‑bit (host configurable)
• Clock frequency: Up to 200 MHz; boot frequency up to 52 MHz
• Data Strobe (DS) pin for HS400 timing
• Hardware reset (RST_n) support
• Command Queuing (CMDQ) with depth up to 8
• RPMB (Replay Protected Memory Block)
• Multiple partitions: boot, RPMB, general‑purpose, user, enhanced
• Secure erase, secure trim, sanitize, discard
• High‑Priority Interrupt (HPI), background operations (BKOPS)
• Field Firmware Update (FFU)
• Device health report & lifetime estimation
• Power‑off notification, sleep mode, auto‑standby
• Full backward compatibility with legacy MMC/e·MMC

3. Voltage Specifications

• VCC (NAND core): 2.7 V – 3.6 V
• VCCQ (I/O interface): 1.70 V – 1.95 V or 2.7 V – 3.6 V
• VDDIM: Internal regulator node; 1 µF cap to GND required
• Ground: VSS & VSSQ (internally connected)

4. Temperature Range

• Operating Temperature (TA): −40 °C to +85 °C
• Max Case Temperature (TC): +95 °C
• Storage Temperature: −40 °C to +85 °C

5. Performance Specifications (8‑bit bus, 25 °C, cache ON)

6. Power Consumption (VCC=3.6V, VCCQ=1.95V, 25°C)

7. Package & Pin Definitions

• Package: 153‑ball TFBGA (code BH)
• Size: 11.5 × 13.0 × 1.1 mm
• Ball Pitch: 0.5 mm; Solder ball: φ0.319 mm (SAC302)
• Key Signals:

8. Key Registers Summary

• OCR: Supports 1.70–1.95 V & 2.7–3.6 V; ready bit [31]
• CID: Manufacturer ID 0x13; product name: S0J35A
• CSD: Defines block length, access timing, device size
• ECSD Revision: 0x08 (e·MMC 5.1)
• Cache Size: 0x00000200 (512 KB)
• Sector Count: 0x00E90000 (8GB)

9. Reliability & Safety Features

• Automatic bad block replacement
• Dynamic wear leveling
• Power‑failure robust design
• Permanent / temporary / power‑on write protection
• Automotive‑grade quality & long‑term reliability
• AEC‑Q104 & AEC‑Q100‑005 compliant

10. Target Applications

• Automotive infotainment & navigation
• ADAS, in‑vehicle compute, dashboard
• Telematics, data logger, connected car
• Industrial embedded systems
• Rugged automotive/industrial storage

11. Ordering & Packaging

• Part Number: MTFC8GAMALBH‑AIT
• Package: 153‑ball TFBGA (BH)
• Shipping: Tray
• Marking: 5‑digit alphanumeric code (Micron decoder)