ams OSRAM SFH 2200 FA

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Specifications
Type
Paramete
Type
Paramete
Current - Dark (Typ)
1nA
Mounting Type
Surface Mount
Viewing Angle
120°
Qualification
-
Spectral Range
740nm ~ 1100nm
Wavelength
940nm
Color - Enhanced
-
Diode Type
PIN
Active Area
7.02mm²
Voltage - DC Reverse (Vr) (Max)
20 V
Operating Temperature
-40°C ~ 85°C
Grade
-
Response Time
40ns
Package / Case
2-SMD, No Lead
Responsivity @ nm
-
Overview

SFH 2200 FA Product Information Summary

Product Overview

  • Manufacturer: OSRAM Opto Semiconductors GmbH
  • Model: SFH 2200 FA
  • Description: TOPLED® Silicon PIN Photodiode

Applications

  • Electronic Equipment
  • Suitable for applications from 800 nm to 1100 nm

Features

  • Package: Black silicone
  • ESD Protection: 2 kV according to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
  • Reflow Soldering: Suitable for reflow soldering
  • Small Package Size: 4 mm x 5.1 mm x 0.85 mm
  • Solder Control Structure

Ordering Information

  • Type: SFH 2200 FA
  • Photocurrent: ≥ 22 µA (typical 23 µA)
  • Ordering Code: Q65112A0248

Maximum Ratings

  • Operating Temperature (Top): -40°C to +85°C
  • Storage Temperature (Tstg): -40°C to +85°C
  • Reverse Voltage (VR): Max 20 V
  • Total Power Dissipation (Ptot): Max 150 mW
  • ESD Withstand Voltage: Max 2 kV according to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Characteristics (TA = 25°C)

  • Wavelength of Max Sensitivity (λS max): 940 nm (typical)
  • Spectral Range of Sensitivity (λ10%): 740 nm to 1100 nm (typical)
  • Radiant Sensitive Area (A): 7.02 mm² (typical)
  • Dimensions of Active Chip Area (L x W): 2.65 mm x 2.65 mm (typical)
  • Half Angle (φ): 60° (typical)
  • Dark Current (IR): 1 nA (typical), 25 nA (max) at VR = 10 V
  • Spectral Sensitivity (Sλ): 0.64 A/W at λ = 850 nm (typical)
  • Quantum Yield (η): 0.93 Electrons/Photon at λ = 850 nm (typical)
  • Open-Circuit Voltage (VO): 0.25 mV (min), 0.35 mV (typical) at Ee = 0.5 mW/cm², λ = 850 nm, VR = 5 V
  • Short-Circuit Current (ISC): 22 µA (typical) at Ee = 0.5 mW/cm², λ = 850 nm
  • Rise Time (tr): 0.04 µs (typical) at VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA
  • Fall Time (tf): 0.04 µs (typical) at VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA
  • Forward Voltage (VF): 1 V (typical) at IF = 100 mA
  • Capacitance (C0): 60 pF (typical) at VR = 0 V, f = 1 MHz
  • Temperature Coefficient of Voltage (TCV): -2.6 mV/K (typical)
  • Temperature Coefficient of Short-Circuit Current (TC): 0.03 %/K (typical) at λ = 850 nm
  • Noise Equivalent Power (NEP): 0.028 pW/Hz^(1/2) at VR = 10 V, λ = 850 nm
  • Detection Limit (D*): 9.5e12 cm x Hz^(1/2)/W at VR = 5 V, λ = 850 nm
  • Thermal Resistance (RthJC): 275 K/W (max)

Relative Spectral Sensitivity

  • Wavelength Range: 400 nm to 1000 nm
  • Sensitivity: Relative spectral sensitivity as a function of wavelength (Srel = f(λ))

Directional Characteristics

  • Angle Range: -120° to +120°
  • Sensitivity: Relative spectral sensitivity as a function of angle (Srel = f(φ))

Photocurrent

  • Irradiance Range: 0.01 to 1000 µW/cm²
  • Photocurrent: Photocurrent as a function of irradiance (IP = f(Ee))

Dark Current

  • Reverse Voltage Range: 0 to 20 V
  • Dark Current: Dark current as a function of reverse voltage (IR = f(VR))

Capacitance

  • Reverse Voltage Range: 0 to 20 V
  • Capacitance: Capacitance as a function of reverse voltage (C = f(VR))

Dark Current vs. Temperature

  • Temperature Range: -40°C to +85°C
  • Dark Current: Dark current as a function of temperature (IR = f(TA))

Power Consumption

  • Temperature Range: -40°C to +85°C
  • Power Consumption: Power consumption as a function of temperature (Ptot = f(TA))

Dimensional Drawing

  • Approximate Weight: 46.0 mg
  • Package Marking: Cathode

Recommended Solder Pad

  • Handling Indication: The package is cast with silicone. Mechanical stress at the silicone surface should be avoided. Pickup the device at the plastic frame.

Reflow Soldering Profile

  • Compliance: MSL Level 2 according to JEDEC J-STD-020E
  • Profile Features:Ramp-up rate to preheat: 2 to 3 K/sTime above liquidus temperature (tL): 80 to 100 sPeak temperature (TP): 245 to 260 °CRamp-down rate: 3 to 6 K/s

Taping

  • Taping Information: Detailed taping dimensions and tolerances

Tape and Reel

  • Reel Dimensions:Width (W): 12 mm ± 0.3 mmMinimum Width (W1): 12.4 mmMaximum Width (W2): 18.4 mmPieces per Reel: 1500

Barcode-Product-Label (BPL)

  • Dry Packing Process: Detailed information on moisture-sensitive labeling and packaging

Notes

  • Eye Safety: The device falls into the class exempt group according to IEC 62471:2006.
  • Environmental Exposure: Minimize exposure to aggressive substances during storage, production, and use.

Disclaimer

  • Terms of Delivery: The information provided is for the type of component and should not be considered as assured characteristics.
  • Product and Functional Safety: OSRAM OS components are not developed, constructed, or tested for safety-critical applications or medical devices.

Glossary

  • Photocurrent: Measured with a tolerance of ±11%.
  • Typical Values: Reflect statistical figures and may differ from actual parameters.
  • Testing Temperature: TA = 25°C (unless otherwise specified)
  • Tolerance of Measure: ±0.1 mm unless otherwise noted.
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