Name: LM57BISDX-5%2FNOPB
Brand: Texas Instruments（TI）
SKU: JM-LM57BISDX-5%2FNOPB
Availability: InStock

Texas Instruments（TI） LM57BISDX-5/NOPB

View All Position, Proximity, Speed (Modules) by Texas Instruments（TI）

Part Number:
LM57BISDX-5/NOPB
Manufacturer:
Texas Instruments（TI）
Category:
Position, Proximity, Speed (Modules)
RoHs:
RoHS Compliant
Datasheet:
LM57BISDX-5/NOPB_Datesheet
Description:
THERMOSTAT PROG ACT HI/LOW 8WSON
In stock 1,022

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Specifications

Type

Paramete

Type

Paramete

Output Type

Open Drain, Push-Pull

Supplier Device Package

8-WSON (2.5x2.5)

Output

Active High, Active Low

Switching Temperature

Programmable

Trip Temperature Threshold

Cold, Hot

Output Function

OverTemp, /OverTemp

Package / Case

8-WFDFN Exposed Pad

Grade

Selectable Hysteresis

Yes

Features

Selectable Trip Point

Voltage - Supply

2.4 V ~ 5.5 V

Mounting Type

Surface Mount

Accuracy

±1.5°C

Current - Output (Max)

Operating Temperature

-50°C ~ 150°C

Qualification

Current - Supply

24µA

Overview

LM57BISDX-5/NOPB Package Option Addendum

Overview

The LM57BISDX-5/NOPB is a resistor-programmable temperature switch and analog temperature sensor from Texas Instruments. This device is designed for precision temperature monitoring and control in various industrial applications.

Package Information

Package Type: WSON (No Lead)
Package Drawing: NGR
Pins: 8
Body Size (Nominal): 2.50 mm × 2.50 mm

Ordering Information

Orderable Part Number: LM57BISDX-5/NOPB
Status: Active
Material Type: Production
Package Quantity: 4500
Carrier: LARGE T&R
RoHS Compliance: Yes
Operating Temperature Range: -50°C to 150°C
Part Marking: 57B5
Lead Finish/Ball Material: SN (Tin)
Moisture Sensitivity Level (MSL): Level-3-260C-168 HR
Peak Reflow Temperature: 260°C

Tape and Reel Information

Reel Diameter: 330.0 mm
Reel Width (W1): 12.0 mm
Tape Dimensions:A0 (mm): 12.4B0 (mm): 2.8K0 (mm): 2.8P1 (mm): 1.0W (mm): 8.0
Pin 1 Quadrant: Q1
SPQ (Standard Pack Quantity): 4500

Tape and Reel Box Dimensions

Length (mm): 356.0
Width (mm): 356.0
Height (mm): 36.0

Package Outline

Package Type: WSON (No Lead)
Body Size: 2.50 mm × 2.50 mm
Lead Pitch: 0.5 mm
Max Height: 0.8 mm

Important Notes

Lead Finish: The lead finish is SN (Tin), which is suitable for most standard soldering processes.
Moisture Sensitivity Level: The device is rated at MSL 3, which means it can be exposed to ambient conditions for up to 168 hours before reflow soldering.
Reflow Temperature: The peak reflow temperature is 260°C, which is typical for lead-free soldering processes.
RoHS Compliance: The device complies with the Restriction of Hazardous Substances (RoHS) directive, ensuring it is free from harmful substances like lead.

Additional Information

Datasheet: For detailed electrical and mechanical specifications, refer to the LM57BISDX-5/NOPB datasheet available on the Texas Instruments website.
Support: For further assistance, contact Texas Instruments customer support or visit the TI E2E Community for technical support and discussions.

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