Microchip Technology TA010-RBYCZT-VAO


- Part Number:
TA010-RBYCZT-VAO
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
TA010-RBYCZT-VAO_Datesheet - Description:
STANDARD CONFIGURATION 1-WIRE 3L
- In stock 0
Information of TA010-RBYCZT-VAO
Basic Overview
- Product Line: CryptoAutomotive™ Family
- Manufacturer: Microchip Technology Inc.
- Document Reference: DS40002440C (Summary Data Sheet, Revised in October 2025)
- Product Type: High-security cryptographic authentication device
- Core Application: Electric Vehicle (EV) battery authentication, ecosystem control, and anti-counterfeiting
- Companion Device Compatibility: Designed to work with Microchip or other vendors’ microcontrollers
- Automotive Qualification: AEC-Q100 Automotive Qualified
- Product Identifier: VAO (Automotive Product Identifier)
Key Specifications
1. Electrical Characteristics
Absolute Maximum Ratings
| Parameter | Specification |
|---|---|
| Operating Temperature Range | -40°C to +125°C (Automotive Grade 1) |
| Storage Temperature Range | -65°C to +150°C |
| Maximum Operating Voltage | 6.0V |
| DC Output Low Current | 20 mA |
| Voltage on Any Pin | -0.5V to (VCC + 0.5V) |
| ESD Ratings (Human Body Model, HBM) | >7 kV (SWI Device) |
| ESD Ratings (Charge Device Model, CDM) | >2 kV |
Critical DC Parameters
| Parameter | Sym. | Min. | Typ. | Max. | Units | Conditions |
|---|---|---|---|---|---|---|
| Power Supply Voltage (VCC) | VCC | 1.65 | - | 5.5 | V | Single-Wire Interface (SWI) mode |
| Sleep Current | ISLEEP | - | 130 | 2000 | nA | Full VCC and temperature range; I/O at GND or VCC |
| Current Consumption in I/O Mode | II/O | - | 60 | 300 | µA | Waiting for I/O |
| Output Low Voltage | VOL | - | - | 0.4 | V | Active mode, VCC = 1.65V to 3.6V, output-low current = 8.0 mA |
| Input High Leakage (SWI) | IIH | - | 1.0 | 2.0 | µA | VIN = VCC |
| Input Low Leakage (SWI) | IIL | -200 | - | 200 | nA | VIN = GND |
| Bus Capacitance (SWI) | CBUS | - | - | 500 | pF | - |
| Theta JA (Thermal Resistance) | θJA | - | 91.5 | - | °C/W | 3-Lead Contact package (when soldered to board) |
2. Package Details
- Package Type: 3-Lead Contact Package (Atmel Legacy Global Package Code RHB)
- Package Dimensions: 2.5 mm (Width) × 6.5 mm (Length)
- Key Package Dimensions (Millimeters)| Dimension | Min. | Nom. | Max. ||-----------|------|------|------|| Overall Height (A) | 0.45 | 0.50 | 0.55 || Standoff (A1) | 0.00 | 0.02 | 0.05 || Terminal Width (b) | 1.60 | 1.70 | 1.80 || Terminal Length (L) | 2.10 | 2.20 | 2.30 || Terminal Pitch (e) | - | 2.00 BSC | - || Package Edge to Terminal Edge (g) | 0.05 | 0.15 | 0.25 |
- Pin Configuration (3-Lead Contact)| Pin # | Function | Interface (SWI) ||-------|----------|-----------------|| 1 | Serial I/O | SI/O || 2 | Ground | GND || 3 | Supply | VCC |
- Note: The exposed backside paddle (if applicable) is recommended to be connected to GND; pin 1 visual index feature varies but is located within the hatched area.
3. Interface and Communication
- Interface Type: Single-Wire Interface (SWI) – Pulse-Width Modulated (PWM)
- SWI Speed: 100 kbps
- Parasitic Power Support: Available for SWI with external capacitor (CMOSen = '1' required)
- Parasitic Power Mode Parameters| Parameter | Sym. | Min. | Max. | Units ||-----------|------|------|------|-------|| Max. I/O Voltage | VPUP | 2.5 | 5.5 | V || Input Low Threshold | VIL1 | -0.5 | 0.3×VPUP | V || Input High Threshold | VIH1 | 0.7×VPUP | VPUP + 0.5 | V |
4. Cryptographic Features
Cryptographic Standards Compliance
- Asymmetric Signing: ECDSA (FIPS186-4), NIST standard P-256 Elliptic Curve
- Hash Functions: SHA-256 and HMAC (compliant with FIPS 198-1)
- Random Number Generator: NIST SP 800-90A/B/C Certified True Random Number Generator (TRNG)
- Compliance Mode: FIPS 140-3 Compliance Mode (configurable via configuration bit)
Secure Storage
- Field-Programmable EEPROM with:
- Unique 72-bit Serial Number
- Monotonic Counter (maximum count value: 10,000) – attachable to ECC/HMAC keys or usable by host system
Security Protection
- Attack Resistance: Joint Interpretation Laboratory (JIL) High Attack Potential Score (compliant with Jil-Application-of-Attack-Potential-to-Smartcards-V3.1)
- Tamper Resistance: Countermeasures against environmental, non-invasive, and invasive fault attacks
- Secure Key Management: Internal asymmetric key generation (private keys never exposed outside the device)
Ordering and Shipping Details
- Full Part Number: TA010-RBYCZT-VAO
- Part Number Breakdown
- Shipping Quantity: 5,000 units per reel
- Package Marking: Vague alphanumeric code (manufacturing lot information only; no device type/manufacturer details for security)
Trust Platform Variants and Provisioning
- Provisioning Services: Supported via Microchip Trust Platform (leverages Trust Platform Design Suite, TPDS)
- Available Flows for TA010: TrustFLEX (pre-configured with customer-unique credentials) and TrustCUSTOM (fully customizable)
- Note: TA010-RBYCZT-VAO follows the standard TA010 cryptographic and security framework; custom provisioning available via TrustCUSTOM flow.
Usage Guidelines and Precautions
- Mounting: For 3-Lead Contact package, Theta JA specifications apply when soldered to a board (typical use case may not require soldering)
- Sleep Mode Optimization: Drive inputs to VCC or use pull-up resistors for lowest sleep current
- SWI Parasitic Power Mode: CMOSen must be set to '1'; avoid CMOSen = '0' in this mode
- Safety Vent Caution: Ensure mounting does not obscure any device safety vents (if applicable)
- Package Disclaimer: UDFN package is deprecated for TA010; VDFN package is recommended (board land pattern is identical for UDFN/VDFN)
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