Microchip Technology TA010-RBYCZT-VAO

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  • Part Number:

    TA010-RBYCZT-VAO

  • Manufacturer:

    Microchip Technology

  • Category:

    Display Drivers

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf TA010-RBYCZT-VAO_Datesheet

  • Description:

    STANDARD CONFIGURATION 1-WIRE 3L

  • In stock 0
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Specifications
Type
Paramete
Type
Paramete
Grade
-
Mounting Type
Surface Mount
Package / Case
3-SMD, No Lead
Qualification
-
Supplier Device Package
3-SMD
Type
Automotive
Applications
-
Overview

Information of TA010-RBYCZT-VAO

Basic Overview

  • Product Line: CryptoAutomotive™ Family
  • Manufacturer: Microchip Technology Inc.
  • Document Reference: DS40002440C (Summary Data Sheet, Revised in October 2025)
  • Product Type: High-security cryptographic authentication device
  • Core Application: Electric Vehicle (EV) battery authentication, ecosystem control, and anti-counterfeiting
  • Companion Device Compatibility: Designed to work with Microchip or other vendors’ microcontrollers
  • Automotive Qualification: AEC-Q100 Automotive Qualified
  • Product Identifier: VAO (Automotive Product Identifier)

Key Specifications

1. Electrical Characteristics

Absolute Maximum Ratings


ParameterSpecification
Operating Temperature Range-40°C to +125°C (Automotive Grade 1)
Storage Temperature Range-65°C to +150°C
Maximum Operating Voltage6.0V
DC Output Low Current20 mA
Voltage on Any Pin-0.5V to (VCC + 0.5V)
ESD Ratings (Human Body Model, HBM)>7 kV (SWI Device)
ESD Ratings (Charge Device Model, CDM)>2 kV

Critical DC Parameters


ParameterSym.Min.Typ.Max.UnitsConditions
Power Supply Voltage (VCC)VCC1.65-5.5VSingle-Wire Interface (SWI) mode
Sleep CurrentISLEEP-1302000nAFull VCC and temperature range; I/O at GND or VCC
Current Consumption in I/O ModeII/O-60300µAWaiting for I/O
Output Low VoltageVOL--0.4VActive mode, VCC = 1.65V to 3.6V, output-low current = 8.0 mA
Input High Leakage (SWI)IIH-1.02.0µAVIN = VCC
Input Low Leakage (SWI)IIL-200-200nAVIN = GND
Bus Capacitance (SWI)CBUS--500pF-
Theta JA (Thermal Resistance)θJA-91.5-°C/W3-Lead Contact package (when soldered to board)

2. Package Details

  • Package Type: 3-Lead Contact Package (Atmel Legacy Global Package Code RHB)
  • Package Dimensions: 2.5 mm (Width) × 6.5 mm (Length)
  • Key Package Dimensions (Millimeters)| Dimension | Min. | Nom. | Max. ||-----------|------|------|------|| Overall Height (A) | 0.45 | 0.50 | 0.55 || Standoff (A1) | 0.00 | 0.02 | 0.05 || Terminal Width (b) | 1.60 | 1.70 | 1.80 || Terminal Length (L) | 2.10 | 2.20 | 2.30 || Terminal Pitch (e) | - | 2.00 BSC | - || Package Edge to Terminal Edge (g) | 0.05 | 0.15 | 0.25 |
  • Pin Configuration (3-Lead Contact)| Pin # | Function | Interface (SWI) ||-------|----------|-----------------|| 1 | Serial I/O | SI/O || 2 | Ground | GND || 3 | Supply | VCC |
  • Note: The exposed backside paddle (if applicable) is recommended to be connected to GND; pin 1 visual index feature varies but is located within the hatched area.

3. Interface and Communication

  • Interface Type: Single-Wire Interface (SWI) – Pulse-Width Modulated (PWM)
  • SWI Speed: 100 kbps
  • Parasitic Power Support: Available for SWI with external capacitor (CMOSen = '1' required)
  • Parasitic Power Mode Parameters| Parameter | Sym. | Min. | Max. | Units ||-----------|------|------|------|-------|| Max. I/O Voltage | VPUP | 2.5 | 5.5 | V || Input Low Threshold | VIL1 | -0.5 | 0.3×VPUP | V || Input High Threshold | VIH1 | 0.7×VPUP | VPUP + 0.5 | V |

4. Cryptographic Features

Cryptographic Standards Compliance

  • Asymmetric Signing: ECDSA (FIPS186-4), NIST standard P-256 Elliptic Curve
  • Hash Functions: SHA-256 and HMAC (compliant with FIPS 198-1)
  • Random Number Generator: NIST SP 800-90A/B/C Certified True Random Number Generator (TRNG)
  • Compliance Mode: FIPS 140-3 Compliance Mode (configurable via configuration bit)

Secure Storage

  • Field-Programmable EEPROM with:
  • Unique 72-bit Serial Number
  • Monotonic Counter (maximum count value: 10,000) – attachable to ECC/HMAC keys or usable by host system

Security Protection

  • Attack Resistance: Joint Interpretation Laboratory (JIL) High Attack Potential Score (compliant with Jil-Application-of-Attack-Potential-to-Smartcards-V3.1)
  • Tamper Resistance: Countermeasures against environmental, non-invasive, and invasive fault attacks
  • Secure Key Management: Internal asymmetric key generation (private keys never exposed outside the device)

Ordering and Shipping Details

  • Full Part Number: TA010-RBYCZT-VAO
  • Part Number Breakdown
  • Shipping Quantity: 5,000 units per reel
  • Package Marking: Vague alphanumeric code (manufacturing lot information only; no device type/manufacturer details for security)

Trust Platform Variants and Provisioning

  • Provisioning Services: Supported via Microchip Trust Platform (leverages Trust Platform Design Suite, TPDS)
  • Available Flows for TA010: TrustFLEX (pre-configured with customer-unique credentials) and TrustCUSTOM (fully customizable)
  • Note: TA010-RBYCZT-VAO follows the standard TA010 cryptographic and security framework; custom provisioning available via TrustCUSTOM flow.

Usage Guidelines and Precautions

  • Mounting: For 3-Lead Contact package, Theta JA specifications apply when soldered to a board (typical use case may not require soldering)
  • Sleep Mode Optimization: Drive inputs to VCC or use pull-up resistors for lowest sleep current
  • SWI Parasitic Power Mode: CMOSen must be set to '1'; avoid CMOSen = '0' in this mode
  • Safety Vent Caution: Ensure mounting does not obscure any device safety vents (if applicable)
  • Package Disclaimer: UDFN package is deprecated for TA010; VDFN package is recommended (board land pattern is identical for UDFN/VDFN)


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