ADSP-TS201SABP-050 Model Information

Overview

The ADSP-TS201SABP-050 is a high-performance embedded processor from the TigerSHARC® series, designed for demanding signal processing and communication infrastructure applications. It offers a powerful combination of processing capabilities, memory, and I/O options, making it suitable for a wide range of applications.

Key Features

• High Instruction Rate: 500 MHz
• On-Chip DRAM: 24 Mbit
• Operating Voltage:VDD: 1.05 VVDD_IO: 2.5 VVDD_DRAM: 1.5 V
• Package: 576-Ball BGA_ED (BP-576)
• Temperature Range: -40°C to +85°C
• Dual Computation Blocks: Supporting both floating-point and fixed-point processing
• Wide Memory Widths: 24 Mbit internal DRAM divided into six 4 Mbit banks
• Flexible I/O Options: Including DMA controller, external port, link ports, and more

Applications

• Telecommunications: Signal processing and infrastructure applications
• Signal Processing: High-performance DSP tasks
• Embedded Systems: Complex processing requirements
• Multiprocessor Systems: Scalable multiprocessing capabilities

Ordering Information

• Model: ADSP-TS201SABP-050
• Temperature Range: -40°C to +85°C
• Instruction Rate: 500 MHz
• On-Chip DRAM: 24 Mbit
• Operating Voltage:VDD: 1.05 VVDD_IO: 2.5 VVDD_DRAM: 1.5 V
• Package: 576-Ball BGA_ED (BP-576)

Package Information

• Package Type: 576-Ball BGA_ED
• Dimensions: 25 mm × 25 mm
• Ball Pitch: 1.00 mm
• Ball Size: 0.56 mm (Ball Pad Size), 0.69 mm (Solder Mask Opening)

Pin Configuration

The ADSP-TS201SABP-050 features a comprehensive set of pins for various functions, including:

• Data and Address Buses: For interfacing with external memory and peripherals
• Control Signals: For managing memory access and I/O operations
• Link Ports: For high-speed data transfer between processors
• JTAG Port: For debugging and testing
• Power and Ground Pins: For stable operation

Thermal Characteristics

• Thermal Resistance (θJA):Airflow = 0 m/s: 12.92°C/WAirflow = 1 m/s: 10.2°C/WAirflow = 2 m/s: 9.0°C/WAirflow = 3 m/s: 8.0°C/W
• Thermal Resistance (θJB): 7.7°C/W
• Thermal Resistance (θJC): 0.7°C/W

Development Tools

• VisualDSP++: Integrated development environment for programming and debugging
• Emulators: For in-circuit debugging and testing
• Evaluation Kits: For prototyping and development