W25N01GVZEIG Complete Supplementary Datasheet Summary

1. Basic Device Identification

• Full Part Number: W25N01GVZEIG
• Manufacturer: Winbond Electronics
• Device Type: 1G-bit (128M-Byte) SLC Serial NAND Flash Memory
• Product Family: W25N01GV Series
• Status: Active, Production
• RoHS/Compliance: Lead-free, Halogen-free, Green, RoHS compliant
• Top Marking: 25N01GVZEIG
• Voltage: Single 2.7V – 3.6V supply
• Temperature Grade: Industrial (I): −40°C to +85°C
• Interface: Standard SPI, Dual SPI, Quad SPI (QSPI)

2. Package & Mechanical Specifications

• Package Type: 8-pad WSON (Package Code ZE)
• Dimensions: 8.0 mm × 6.0 mm × 0.75 mm (nominal)
• Pin Pitch: 1.27 mm BSC
• Mounting: Surface-mount (SMT)
• Exposed Pad: Exposed thermal pad (EP), floating or connectable to GND
• Moisture Sensitivity Level: Industry standard for WSON

3. Memory Architecture

• Total Density: 1G-bit (134,217,728 bytes)
• Page Size: 2048 bytes main + 64 bytes spare = 2112 bytes
• Block Size: 64 pages = 128 KB
• Number of Blocks: 1024 blocks
• Valid Blocks: Min 1004 guaranteed at shipment
• Organization: 65,536 programmable pages

4. Key Performance Parameters

• Clock Frequency: Up to 104 MHz (STR)
• Equivalent Speed: Dual I/O 208 MHz; Quad I/O 416 MHz
• Continuous Data Rate: Up to 50 MB/s
• Endurance: 100,000+ program/erase cycles
• Data Retention: 10+ years
• Page Program Time: Typ 250 µs, Max 700 µs
• Block Erase Time: Typ 2 ms, Max 10 ms
• Page Read Time: Max 60 µs (ECC enabled)
• Partial Page Programs: 4 times per page

5. Power Characteristics

• Active Current (Read/Program/Erase): Max 35 mA, Typ 25 mA
• Standby Current: Typ 10 µA; Max 50 µA @ 85°C
• Supply Voltage (VCC): 2.7 V to 3.6 V
• Logic Levels:

6. Pin Configuration (8‑Pad WSON ZE, Top View)

表格

7. Core Features

• On-chip 1-bit ECC: Automatic error correction, enabled by default
• Read Modes:
• Bad Block Management: Internal LUT supports up to 20 block replacements
• Write Protection: Software (BP bits) + Hardware (/WP pin) + Power Lock + OTP Lock
• Hold Function: Pause SPI operations without deselecting
• OTP Area: 10 × 2112-byte OTP pages; permanent lockable
• Unique ID & Parameter Pages: Factory-programmed read-only pages
• Software Reset: Device reset via instruction (FFh)
• Status Registers: SR‑1 (Protection), SR‑2 (Config), SR‑3 (Status)

8. Protection & Security

• Block Protection: BP[3:0] + TB bits protect selectable memory ranges
• Status Register Protection: SRP[1:0] for software/hardware/power/OTP lock
• OTP Lock: OTP‑L bit permanently locks OTP pages
• Power‑Up Lock: All write operations disabled until VCC stable + tPUW delay
• Write Enable Latch (WEL): Must be set before program/erase

9. Supported Key Instructions

• Read JEDEC ID (9Fh), Read Status (05h/0Fh), Write Status (01h/1Fh)
• Write Enable (06h), Write Disable (04h)
• Block Erase (D8h), Page Data Read (13h), Read Data (03h), Fast Read (0Bh)
• Dual/Quad I/O Fast Read (3Bh, 6Bh, BBh, EBh)
• Load Program Data (02h, 84h, 32h, 34h), Program Execute (10h)
• Bad Block Management (A1h), Read BBM LUT (A5h)
• Device Reset (FFh)

10. Reliability & Quality

• ESD Rating: ±2000 V (HBM)
• Invalid Block Management: Built‑in bad block marking and handling
• Error Monitoring: ECC status, P‑FAIL, E‑FAIL, BUSY bits
• Thermal Handling: −40°C to +85°C (ambient); −65°C to +150°C storage

11. Typical Applications

• Code shadowing to RAM
• Embedded system firmware & data storage
• Industrial control, IoT, consumer electronics
• Portable devices with limited PCB space
• XIP (eXecute In Place) via Quad SPI