Winbond Electronics W25Q256JVEIQ

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  • Part Number:

    W25Q256JVEIQ

  • Manufacturer:

    Winbond Electronics

  • Category:

    Display Drivers

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf W25Q256JVEIQ_Datesheet

  • Description:

    IC FLASH 256MBIT SPI/QUAD 8WSON

  • In stock 34,495
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Specifications
Type
Paramete
Type
Paramete
Access Time
-
Memory Format
FLASH
Package / Case
8-WDFN Exposed Pad
Write Cycle Time - Word, Page
3ms
Operating Temperature
-40°C ~ 85°C (TA)
Qualification
-
Memory Organization
32M x 8
Memory Type
Non-Volatile
Voltage - Supply
2.7V ~ 3.6V
Memory Interface
SPI - Quad I/O
Clock Frequency
133 MHz
Mounting Type
Surface Mount
Technology
FLASH - NOR
Memory Size
256Mbit
Grade
-
Supplier Device Package
8-WSON (8x6)
Overview

W25Q256JVEIQ – Complete Datasheet Summary


1. Basic Identification


  • Full Part Number: W25Q256JVEIQ
  • Manufacturer: Winbond Electronics Corporation
  • Family: SpiFlash W25Q256JV Series
  • Density: 256M‑bit / 32M‑byte
  • Voltage: 2.7V to 3.6V single supply
  • Temperature Range: Industrial (‑40°C to +85°C)
  • Package: 8‑pad WSON 8×6 mm (Package Code E)
  • Marking: 25Q256JVEQ
  • RoHS / Green: Lead‑free, halogen‑free, Sb₂O₃‑free
  • Quad Enable: Factory fixed QE=1 (Quad IO enabled by default)


2. Key Features


  • High‑Speed SPI
  • Memory Architecture
  • Low Power
  • Reliability
  • Security
  • Special Functions


3. Memory Organization


  • Total memory: 33,554,432 bytes
  • Page: 131,072 pages × 256 bytes
  • Sector: 8,192 sectors × 4KB
  • Block: 512 blocks × 64KB


4. Electrical Specifications


Operating Ranges


  • Supply voltage: 2.7V – 3.6V
  • Operating temperature: ‑40°C to +85°C

Timing Parameters (Typical/Max)


  • Page Program time: 0.7 ms / 3 ms
  • Sector Erase (4KB): 50 ms / 400 ms
  • 32KB Block Erase: 120 ms / 1600 ms
  • 64KB Block Erase: 150 ms / 2000 ms
  • Chip Erase: 80 s / 400 s
  • Write Status Register: 10 ms / 15 ms
  • Reset time: 30 µs

DC Characteristics


  • Standby current (ICC1): max 60 µA
  • Power‑down current (ICC2): max 20 µA
  • Read current (104MHz): max 20 mA
  • Program/Erase current: max 25 mA


5. Pin Configuration (WSON‑8 8×6 mm, Top View)

Pin No.Pin NameFunction
1/CSChip Select
2DO (IO1)Data Out / I/O 1
3/WP (IO2)Write Protect / I/O 2
4GNDGround
5DI (IO0)Data In / I/O 0
6CLKSerial Clock
7IO3I/O 3 (HOLD/RESET function disabled)
8VCCPower Supply


6. Protection Mechanisms


  • Block Protection: BP0–BP3, TB, CMP bits
  • Individual Block/Sector Lock: WPS=1 mode
  • Power‑supply lockout
  • Hardware /WP pin protection
  • OTP lock for security registers
  • Volatile & non‑volatile status register protection


7. Supported Instructions (Main)


  • Read: Fast Read, Dual/Quad I/O Read
  • Program: Page Program, Quad Input Page Program
  • Erase: 4KB Sector, 32KB/64KB Block, Chip Erase
  • Suspend/Resume: Erase/Program Suspend (75h), Resume (7Ah)
  • Protection: Write Enable/Disable, Lock/Unlock
  • ID: Read JEDEC ID (9Fh), Unique ID (4Bh)
  • Reset: Enable Reset (66h), Reset (99h)


8. Package Mechanical Data


  • Package Type: WSON‑8, 8.0×6.0 mm
  • Thickness: 0.75 mm (nominal)
  • Pitch: 1.27 mm
  • RoHS compliant, halogen‑free


9. Ordering & Marking


  • Full part: W25Q256JVEIQ
  • Topside marking: 25Q256JVEQ
  • Package code: E
  • Grade: Industrial (I)
  • QE: Fixed QE=1 (Quad SPI always enabled)


10. Typical Applications


  • Code storage & execute‑in‑place (XIP)
  • Industrial controllers
  • IoT devices
  • Consumer electronics
  • Wearable & battery‑powered systems
  • Data logging & firmware storage
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