XPC850ZT66BU Product Information

Overview

The XPC850ZT66BU is a high-performance integrated communications processor from Freescale Semiconductor, designed for a variety of controller applications, particularly in communications and networking products. It includes support for Ethernet and is specifically designed for cost-sensitive, remote-access, and telecommunications applications.

Features

• Embedded MPC8xx Core: High-performance embedded 32-bit RISC processor.
• Memory Controller: Supports DRAM, SDRAM, SRAM, EPROM, and flash memory.
• Communications Processor Module (CPM): Incorporates a specialized, independent RISC communications processor.
• Serial Channels: Up to seven serial channels, including SCCs, USB, SMCs, I2C, and SPI.
• Ethernet Support: 10/100 Mbps Ethernet support.
• Clock Speed: 66 MHz.

Ordering Information

• Part Number: XPC850ZT66BU
• Package Type: 256-Lead Plastic Ball Grid Array (PBGA)
• Operating Temperature Range: 0°C to 95°C (Commercial Grade)
• Frequency: 66 MHz

Pin Assignments

The XPC850ZT66BU features a 256-Lead PBGA package with JEDEC standard pin numbering. The pin assignments are detailed in the technical specification document, which includes:

• Power and Ground Pins: VDDH, VDDL, VSS, etc.
• Clock Pins: CLKOUT, EXTCLK, XTAL, etc.
• Control Signals: TA, TEA, WE, BURST, etc.
• Data and Address Pins: D[0:31], A[6:31], etc.
• General Purpose I/Os: GPL_A[0–5], GPL_B[0–5], etc.
• Interrupt and Status Pins: IRQ[0–7], HRESET, SRESET, etc.
• Communications Ports: SCCs, USB, SMCs, I2C, SPI, etc.

Mechanical Data

• Package Dimensions: 23.00 mm x 23.00 mm (BSC) with 1.27 mm ball pitch.
• Ball Diameter: 0.60 mm to 0.90 mm.
• Primary Datum and Seating Plane: Defined by the package dimensions.

Electrical Characteristics

• Supply Voltage: VDDH, VDDL, KAPWR, VDDSYN, etc., with specified ranges.
• Input Voltage Tolerance: Specified for various input pins.
• Output Voltage Levels: VOH and VOL for various output pins.
• Power Dissipation: Detailed in the technical specifications.

Thermal Characteristics

• Thermal Resistance: θJA (junction-to-ambient) is specified.
• Thermal Management: Recommendations for heat dissipation and thermal vias.

Documentation and Support

• Technical Data Sheet: Contains detailed information on electrical and thermal characteristics, pin assignments, and mechanical data.
• Application Notes: Available for guidance on PCB layout, thermal management, and other design considerations.