Part Number 150060YS75000 Information

Basic Information

• Part Number: 150060YS75000
• Product Name: WL-SMCW SMT Mono-color Chip LED Waterclear
• Size/Type: 0603
• Business Unit: eiPal
• Status: Valid
• Manufacturer: Würth Elektronik eiSos GmbH & Co. KG
• Website: Würth Elektronik
• Contact: [email protected]
• Address: EMC & Inductive Solutions Max-Eyth-Str. 1, 74638 Waldenburg, Germany
• Phone: +49 (0) 79 42 945 - 0

Dimensions

• R: 0.175 mm (typ.)
• Height: 0.7 mm (typ.)
• Width: 0.7 mm ± 0.1 mm
• Length: 1.1 mm ± 0.1 mm
• Polarity Mark: 0.3 mm ± 0.1 mm
• Scale: 20:1

Recommended Land Pattern

• Length: 2.4 mm
• Width: 0.8 mm

Schematic

• Pin 1: Anode (+)
• Pin 2: Cathode (-)

Electrical & Optical Properties

Test Conditions

• Power Dissipation (PDiss): 72 mW
• Peak Forward Current (F Peak): 100 mA (10% duty/ 10 @ 1 kHz)
• Continuous Forward Current (F): 30 mA
• Reverse Voltage (VREV): 5 V
• ESD Threshold/ Human Body Model (VESD HBM): 2000 V
• Junction Temperature (TJ): 95 °C

Optical Properties

• Peak Wavelength (λPeak): 595 nm (20 mA)
• Dominant Wavelength (λDom): 590 nm (20 mA)
• Luminous Intensity (IV): 90 - 120 mcd (20 mA)
• Forward Voltage (VF): 2.0 - 2.4 V (20 mA)
• Spectral Bandwidth (Δλ): 15 nm (20 mA)
• Reverse Current (IREV): 10 µA (5 V)
• Viewing Angle (Phi): 140° (2θ50% at 20 mA)

Certifications

• RoHS Approval: Compliant [2011/65/EU & 2015/863]
• REACh Approval: Conform or declared [ (EC)1907/2006 ]
• Halogen Free: Conform [IEC 61249-2-21]
• Halogen Free: Conform [JEDEC JS709B]

Packaging Specification - Tape and Reel

• Tape Width: 8 mm
• Pull-off Force: 0.1 N - 1.0 N
• Tape Type: 2a VPE
• Packaging Unit: 4000 pcs
• Material: Polystyrene

Reflow Profile for SMT Components

Classification Reflow Soldering Profile (IPC/ JEDEC J-STD-020E)

• Volume mm³ < 350: 260 °C
• Volume mm³ 350 - 2000: 260 °C
• Volume mm³ > 2000: 260 °C
• Package Thickness < 1.6 mm: 260 °C
• Package Thickness 1.6 mm - 2.5 mm: 250 °C
• Package Thickness ≥ 2.5 mm: 245 °C

Reflow Profile Details

• Preheat Temperature (Ts min - Ts max): 150 °C - 200 °C
• Preheat Time (ts): max. 60 - 120 seconds
• Ramp-up Rate (TL to TP): 3 °C/second max.
• Liquidous Temperature (TL): 217 °C
• Time above TL (tL): max. 60 seconds
• Peak package body temperature (Tp): See table
• Time within 5°C of peak temperature (tp): max. 10 seconds
• Ramp-down Rate (TL to TP): 6 °C/second max.
• Time 25°C to peak temperature: max. 220 seconds

Cautions and Warnings

• General: This component is designed for general electronic equipment. Written approval from Würth Elektronik is required for use in high-safety or high-reliability applications.
• Soldering: Follow Würth Elektronik's soldering specifications to avoid voiding the warranty.
• Cleaning and Washing: Avoid using washing agents that may damage the component. Do not use brushes during cleaning.
• Potting: Inspect manually after potting to avoid damage from material shrinkage or expansion.
• Storage Conditions: Use within 12 months of shipment. Avoid direct sunlight. Store in original packaging.
• Handling: Handle with care to avoid damage. Use ESD prevention methods. Use resistors for protection.
• Technical Specification: Typical values are statistical and may vary. Contact Würth Elektronik for specific binning requirements.

Important Notes

• Customer Responsibility: Evaluate product suitability for specific applications. Würth Elektronik does not warrant suitability for customer-specific applications.
• Product R&D: Specifications may change due to product improvement. Customers should verify the latest data sheets.
• Product Life Cycle: Production may be discontinued. Verify availability with Würth Elektronik before design-in.
• Property Rights: Würth Elektronik retains all rights to products developed based on customer ideas or models.