Analog Devices Inc.(ADI) ADP5070ACPZ-R7


- Part Number:
ADP5070ACPZ-R7
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant
- Datasheet:
ADP5070ACPZ-R7_Datesheet
- Description:
IC REG BST SEPIC ADJ DL 20LFCSP
- In stock 9,099
Product Specification Summary for ADP5070ACPZ-R7
Basic Information
- Manufacturer: Analog Devices, Inc.
- Part Number: ADP5070ACPZ-R7
- Package Type: 20-Lead Lead Frame Chip Scale Package (LFCSP)
- Package Option: CP-20-8
- Operating Temperature Range: -40°C to +125°C
- RoHS Compliance: Yes (indicated by "-R7" suffix)
Description
- Type: Dual High Performance DC-to-DC Regulator
- Function: Generates Independently Regulated Positive and Negative Outputs
- Features:Wide input supply voltage range: 2.85V to 15VGenerates well-regulated, independently resistor-programmable VPOS and VNEG outputsBoost regulator to generate VPOS output with adjustable positive output up to 39VInverting regulator to generate VNEG output with adjustable negative output down to VIN - 39VTrue shutdown for both positive and negative outputs1.2MHz/2.4MHz switching frequency with optional external frequency synchronization from 1.0MHz to 2.6MHzResistor programmable soft start timerSlew rate control for lower system noiseIndividual precision enable and flexible start-up sequence controlOut-of-phase operationUVLO, OCP, OVP, and TSD protection4mm × 4mm, 20-lead LFCSP packageSupported by the ADIsimPower tool set
Applications
- Bipolar Amplifiers: High performance analog applications
- ADCs and DACs: High precision data acquisition systems
- Multiplexers: Signal routing in complex systems
- Charge-Coupled Device (CCD) Bias Supply: Imaging applications
- Optical Module Supply: Telecommunications and data transmission
- RF Power Amplifier (PA) Bias: High frequency communication systems
Ordering Information
- Model: ADP5070ACPZ-R7
- Temperature Range: -40°C to +125°C
- Package: 20-Lead Lead Frame Chip Scale Package (LFCSP)
- Package Option: CP-20-8
- RoHS Compliance: Yes (indicated by "-R7" suffix)
Package Dimensions
- Compliant to JEDEC Standards: MO-220-WGGD-11
- Body Size: 4 mm × 4 mm
- Package Height: 0.75 mm
Additional Information
- Evaluation Board: ADP5070CP-EVALZ available for LFCSP package
- Support Tools: ADIsimPower design toolset for optimized power designs
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Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)

Analog Devices Inc.(ADI)