Analog Devices Inc.(ADI) ADXL362BCCZ-RL7

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Specifications
Type
Paramete
Type
Paramete
Output Type
SPI
Qualification
-
Axis
X, Y, Z
Operating Temperature
-40°C ~ 85°C
Package / Case
16-TFLGA
Sensitivity (mV/g)
-
Acceleration Range
±2g, 4g, 8g
Features
Sleep Mode, Temperature Sensor
Sensitivity (LSB/g)
1 (±2g) ~ 4 (±8g)
Bandwidth
6.25Hz ~ 400Hz
Type
Digital
Voltage - Supply
1.6V ~ 3.5V
Mounting Type
Surface Mount
Grade
-
Supplier Device Package
16-LGA (3x3.25)
Overview

ADXL362BCCZ‑RL7 Complete Datasheet Summary


1. Basic Device Information


  • Part Number: ADXL362BCCZ‑RL7
  • Device Type: Ultralow‑Power, 3‑Axis Digital MEMS Accelerometer
  • Manufacturer: Analog Devices Inc.
  • Document Revision: Rev. G
  • Package: 16‑Terminal LGA (3 mm × 3.25 mm × 1.06 mm), CC‑16‑4
  • Packaging: Tape‑and‑Reel, 1500 units per reel
  • RoHS Status: Compliant (marked by “Z” suffix)
  • Temperature Range: Industrial, −40°C to +85°C
  • Key Features: Micropower, motion wake‑up, FIFO, SPI interface, integrated temperature sensor

2. Key Features


  • Ultralow power consumption:
  • High resolution: 1 mg/LSB (±2 g range)
  • Selectable measurement ranges: ±2 g / ±4 g / ±8 g
  • Low noise: down to 175 µg/√Hz (ultra‑low‑noise mode)
  • Wide supply & I/O voltage: 1.6 V to 3.5 V
  • Built‑in FIFO: 512‑sample deep buffer
  • Autonomous activity/inactivity detection with interrupts
  • Integrated temperature sensor
  • SPI digital interface (4‑wire)
  • External synchronization & clock input
  • Small, thin LGA package

3. Typical Applications


  • Hearing aids & home healthcare devices
  • Motion‑activated power‑save switches
  • Wireless sensors & battery‑powered systems
  • Motion metering & industrial monitoring
  • Fall detection & motion logging

4. Pin Configuration (16‑Terminal LGA, Top View)


Pin No.NameDescription
1VDD I/OI/O supply voltage
2NCNo connect
3ReservedLeave open or tie to GND
4SCLKSPI clock
5ReservedLeave open or tie to GND
6MOSISPI data input
7MISOSPI data output
8CSSPI chip select (active low)
9INT2Interrupt 2 / external sync input
10ReservedLeave open or tie to GND
11INT1Interrupt 1 / external clock input
12, 13, 16GNDGround
14VSMain power supply
15NCNo connect

5. Absolute Maximum Ratings


  • Supply voltage (VS): −0.3 V to +3.6 V
  • I/O supply (VDD I/O): −0.3 V to +3.6 V
  • Acceleration (powered/unpowered): 5000 g
  • ESD: 2000 V (HBM)
  • Storage temperature: −50°C to +150°C
  • Soldering: 260°C peak (Pb‑free reflow)

6. Recommended Operating Conditions


  • Supply voltage (VS): 1.6 V to 3.5 V
  • I/O supply (VDD I/O): 1.6 V to 3.5 V
  • Operating temperature: −40°C to +85°C
  • Output data rate: 12.5 Hz to 400 Hz
  • Measurement ranges: ±2 g, ±4 g, ±8 g

7. Key Electrical Specifications (TA = 25°C, VS = 2.0 V)


Power


  • Normal operation: 1.8 µA @ 100 Hz
  • Wake‑up mode: 270 nA
  • Standby: 10 nA

Performance


  • Resolution: 12 bits (1 mg/LSB @ ±2 g)
  • Noise density: 550 µg/√Hz (normal), 175 µg/√Hz (ultra‑low‑noise)
  • Sensitivity: 1000 LSB/g (±2 g), 500 LSB/g (±4 g), 250 LSB/g (±8 g)
  • Bandwidth: Programmable (ODR/2 or ODR/4)

Temperature Sensor


  • Sensitivity: 0.065 °C/LSB
  • Resolution: 12 bits

8. Functional Description


  • Operating Modes:
  • Sensing: 3‑axis MEMS capacitive sensing
  • Signal Path: 12‑bit ADC, antialiasing filters
  • FIFO: 512‑sample buffer (stream, oldest‑saved, triggered modes)
  • Motion Detection:
  • Communication: 4‑wire SPI (CPHA = CPOL = 0, up to 8 MHz)

9. Protection & Features


  • Self‑test: Electrostatic actuation verifies mechanical & electronic paths
  • SEU protection: Error correction for critical registers
  • Bus keepers: Prevent floating inputs
  • Thermal shutdown: Over‑temperature protection
  • Fail‑safe: Default high‑Z interrupt pins

10. Package & Ordering


  • Part: ADXL362BCCZ‑RL7
  • Package: 16‑LGA (3 × 3.25 × 1.06 mm)
  • Temperature: −40°C to +85°C
  • RoHS compliant
  • Quantity: 1500 per reel
  • Marking: 362B

11. Thermal Information (LGA)


  • Junction‑to‑ambient thermal resistance (θJA): 150°C/W
  • Junction‑to‑case thermal resistance (θJC): 85°C/W
  • Weight: 18 mg

12. Layout & Design Guidelines


  • Decouple VS and VDD I/O with 0.1 µF ceramic caps close to pins
  • Mount near rigid PCB mounting points to reduce vibration errors
  • Keep SPI lines short; minimize noise on power & ground
  • Follow recommended LGA land pattern


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