AT25DF081A-SH-T Model Information

Basic Information

• Manufacturer: Renesas Electronics Corporation
• Product Family: Serial Flash Memory
• Device Density: 8-megabit (1MB)
• Interface: SPI (Serial Peripheral Interface)
• Operating Voltage: 2.7V to 3.6V
• Maximum Frequency: 100 MHz (RapidS Operation), 85 MHz (SPI Operation)
• Temperature Range: Industrial (-40°C to +85°C)

Package Information

• Package Type: 8-lead, 0.208" wide SOIC (EIAJ)
• Lead Finish: NiPdAu (Lead-free/Halide-free/RoHS Compliant)
• Package Drawing: 8S2

Features

• High-Speed Operation: Supports RapidS™ operation up to 100 MHz and SPI operation up to 85 MHz.
• Flexible Erase Architecture: Uniform 4-Kbyte, 32-Kbyte, and 64-Kbyte block erase options, as well as full chip erase.
• Individual Sector Protection: 16 sectors of 64-Kbytes each with hardware-controlled locking via the WP pin.
• Sector Lockdown: Permanently lock down any combination of 64-Kbyte sectors to make them read-only.
• OTP Security Register: 128-byte programmable OTP security register for unique device serialization, ESN storage, and locked key storage.
• Fast Program and Erase Times:Page Program (256 Bytes): 1.0 ms typical4-Kbyte Block Erase: 50 ms typical32-Kbyte Block Erase: 250 ms typical64-Kbyte Block Erase: 400 ms typical
• Low Power Dissipation:Active Read Current: 5 mA typical at 20 MHzDeep Power-Down Current: 5 µA typical
• Endurance: 100,000 program/erase cycles
• Data Retention: 20 years
• Compliance: Full industrial temperature range, RoHS compliant

Ordering Information

• Ordering Code: AT25DF081A-SH-T
• Shipping Carrier Option: Tape and reel
• Package Type: 8-lead, 0.208" wide SOIC (EIAJ)
• Lead Finish: NiPdAu
• Operating Voltage: 2.7V to 3.6V
• Maximum Frequency: 100 MHz (RapidS Operation), 85 MHz (SPI Operation)
• Temperature Range: Industrial (-40°C to +85°C)

Pin Descriptions

• CS (Chip Select): Asserting the CS pin selects the device. When deasserted, the device is deselected and placed in standby mode.
• SCK (Serial Clock): Provides the clock signal for data transfer.
• SI (Serial Input): Used to shift data into the device, including command and address sequences.
• SO (Serial Output): Used to shift data out from the device.
• WP (Write Protect): Controls hardware locking of protected sectors. Internally pulled high; can be left floating but should be externally connected to VCC if hardware protection is used.
• HOLD: Temporarily pauses serial communication without deselecting or resetting the device. Internally pulled high; can be left floating but should be externally connected to VCC if the Hold function is used.

Memory Organization

• Total Capacity: 8-megabit (1MB)
• Block Sizes:4-Kbyte blocks32-Kbyte blocks64-Kbyte blocks
• Sectors: 16 sectors of 64-Kbytes each

Commands and Operations

• Read Commands: Read Array (1Bh, 0Bh, 03h), Dual-Output Read Array (3Bh)
• Program and Erase Commands: Byte/Page Program (02h), Dual-Input Byte/Page Program (A2h), Block Erase (20h, 52h, D8h), Chip Erase (60h, C7h)
• Protection Commands: Write Enable (06h), Write Disable (04h), Protect Sector (36h), Unprotect Sector (39h), Global Protect/Unprotect, Sector Lockdown (33h), Freeze Sector Lockdown State (34h)
• Security Commands: Program OTP Security Register (9Bh), Read OTP Security Register (77h)
• Status Register Commands: Read Status Register (05h), Write Status Register Byte 1 (01h), Write Status Register Byte 2 (31h)
• Miscellaneous Commands: Reset (F0h), Read Manufacturer and Device ID (9Fh), Deep Power-Down (B9h), Resume from Deep Power-Down (ABh)

Electrical Specifications

• Absolute Maximum Ratings:Operating Temperature: -55°C to +125°CStorage Temperature: -65°C to +150°CInput Voltage: -0.6V to +4.1VOutput Voltage: -0.6V to VCC + 0.5V
• DC Characteristics:Standby Current (ISB): 25 µA to 50 µADeep Power-Down Current (IDPD): 5 µA to 10 µAActive Current (ICC1): 17 mA to 20 mA at 100 MHzActive Current (ICC2): 10 mA to 15 mA during program operationActive Current (ICC3): 12 mA to 18 mA during erase operation
• AC Characteristics:Maximum Clock Frequency: 100 MHz (RapidS), 85 MHz (SPI)Clock High Time (tCLKH): 4.3 nsClock Low Time (tCLKL): 4.3 nsData In Setup Time (tDS): 2 nsData In Hold Time (tDH): 1 nsOutput Valid Time (tV): 5 nsOutput Hold Time (tOH): 2 ns

Packaging Dimensions (8S2 - EIAJ SOIC)

• Body Size: 7.70 mm to 8.26 mm (width)
• Lead Length: 5.18 mm to 5.40 mm
• Lead Width: 1.27 mm (Basic Size)
• Lead Thickness: 0.35 mm to 0.48 mm

Revision History

• 8715F (2/2022): Changed company logo to Renesas.
• 8715E (11/2017): Added patent information.
• 8715D (8/2017): Updated corporate address.
• 8715C (1/2013): Update to Adesto logos, abbreviated title to SPI.
• 8715B (8/2010): Changed tRDPD Max from 10 to 30 in AC Parameters.
• 8715A (6/2010): Initial document release.