EPC EPC2101

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  • Part Number:

    EPC2101

  • Manufacturer:

    EPC

  • Category:

    FET, MOSFET Arrays

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf EPC2101_Datesheet

  • Description:

    GANFET 2N-CH 60V 9.5A/38A DIE

  • In stock 533
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Specifications
Type
Paramete
Type
Paramete
Drain to Source Voltage (Vdss)
60V
Rds On (Max) @ Id, Vgs
11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Technology
GaNFET (Gallium Nitride)
Mounting Type
Surface Mount
Package / Case
Die
Input Capacitance (Ciss) (Max) @ Vds
300pF @ 30V, 1200pF @ 30V
Operating Temperature
-40°C ~ 150°C (TJ)
Power - Max
-
Vgs(th) (Max) @ Id
2.5V @ 3mA, 2.5V @ 12mA
FET Feature
-
Gate Charge (Qg) (Max) @ Vgs
2.7nC @ 5V, 12nC @ 5V
Current - Continuous Drain (Id) @ 25°C
9.5A, 38A
Grade
-
Configuration
2 N-Channel (Half Bridge)
Qualification
-
Supplier Device Package
Die
Overview

DESCRIPTION

· EPC2101 eGaN® ICs are enhancement-mode GaN power transistors in a half-bridge configuration, supplied in passivated die form with solder bumps.
· Die size: 6.05 mm x 2.3 mm.
· Designed for high-frequency DC-DC conversion and point-of-load (POL) converters.
· Utilizes Gallium Nitride's high electron mobility and low temperature coefficient for low RDS(on), low QG, and zero QRR.



FEATURES

· High frequency operation capability.
· Ultra-high efficiency performance.
· Compact, high-density footprint.
· Low on-state losses and high switching frequency suitability.
· Robust thermal characteristics with specified thermal resistance values.



APPLICATIONS

· High frequency DC-DC converters.
· Point-of-Load (POL) converters.
· Systems requiring high efficiency and compact power solutions.



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