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Altera EPM3256ATI144-10
- Part Number:
EPM3256ATI144-10
- Manufacturer:
- Category:
- RoHs:
Non-RoHS Compliant - Datasheet:
- Description:
EE PLD, 10NS, 256-CELL, CMOS, PQ
- In stock 10,008
EPM3256ATI144-10 – Complete Accessory & Packing Model Information
(Altera MAX 3000A CPLD, 256 macrocells, 144-pin TQFP, –10 speed grade, industrial temp.)
1. Device Overview
- Orderable Part Number: EPM3256ATI144-10
- Family: MAX 3000A (EEPROM-based CPLD)
- Macrocells: 256 (16 LABs × 16 macrocells)
- Usable Gates: ≈ 5,000
- Package: TI144 = 144-pin TQFP (thin quad flat-pack)
- Lead Pitch: 0.50 mm
- Body Size: 20 mm × 20 mm × 1.00 mm max height
- Speed Grade: –10 (tPD1 = 10 ns, fCNT = 98 MHz)
- Temperature: Industrial –40 °C to +85 °C
- RoHS: RoHS-compliant (lead-free) finish
- MSL Rating: MSL-3 (168 h floor life ≤30 °C/60 % RH)
2. Standard Shipping Accessories
| Item | Details |
|---|---|
| Carrier | 24 mm embossed conductive polymer tape, 12 mm pitch |
| Cover Tape | Heat-activated multi-layer film, antistatic coated |
| Reel | 13-inch (Ø 330 mm) conductive polystyrene, blue |
| Qty / Reel | 1 000 pieces |
| Dry-Pack | Required (MSL-3): moisture-barrier bag + 2 desiccant packs + 6-dot HIC card |
| ESD Warning | ANSI/ESD S8.1 label on inner & outer cartons |
| Box Label | 2-D matrix + human-readable lot/date/trace code |
3. Tape & Reel Dimensions – EIA-481-D
| Symbol | Value |
|---|---|
| A0 (cavity width) | 22.3 ± 0.1 mm |
| B0 (cavity length) | 22.3 ± 0.1 mm |
| K0 (cavity depth) | 1.5 ± 0.1 mm |
| P1 (pitch) | 12.0 ± 0.1 mm |
| W (tape width) | 24.0 ± 0.3 mm |
| D0 (sprocket hole) | Ø1.5 +0.1 mm |
| Pin-1 quadrant | Q1 (lower-left when feeding right) |
4. Carton & Logistics
| Level | Pieces | Box Size (mm) | Weight (kg) |
|---|---|---|---|
| Inner box | 1 reel (1 000) | 370 × 370 × 38 | ≈ 0.9 |
| Outer carton | 4 reels (4 000) | 390 × 390 × 160 | ≈ 4.2 |
| Bar-code | Code-128 on all sides, 2-D matrix on top |
5. PCB Assembly Accessories
5.1 Recommended Land Pattern (TQFP-144, 0.5 mm)
| Dimension | mm |
|---|---|
| Pad width | 0.25 |
| Pad length | 1.30 |
| Lead pitch | 0.50 |
| Pad row spacing | 19.00 |
| Thermal pad | Not required (no exposed pad) |
| Silk-screen keep-out | 0.15 mm beyond pads |
5.2 Stencil Design
- Stencil thickness: 0.12 mm (5 mil) laser-cut stainless steel
- Aperture: 1:1 with pad, 10 % area reduction on center leads to reduce bridging
- Aperture shape: rounded rectangle, 0.12 mm radius
6. Reflow Soldering Profile (Pb-Free)
| Zone | Parameter | Value |
|---|---|---|
| Ramp-up | ≤3 °C/s to 150 °C | |
| Preheat | 150–200 °C, 60–180 s | |
| Time above 217 °C | 60–150 s | |
| Peak temperature | 260 °C max | |
| Time within 5 °C of peak | 20–40 s | |
| Ramp-down | ≤6 °C/s | |
| Max cycles | 3 |
7. Programming & Debug Accessories
| Tool / File | Description |
|---|---|
| ByteBlasterMV | Parallel-port ISP cable (legacy) |
| MasterBlaster | USB-to-JTAG ISP cable (current) |
| Jam STAPL file | .jam or .jbc for boundary-scan & ISP |
| JTAG header | 10-pin ARM Cortex-M style (0.05″) recommended |
| ISP voltage | 3.3 V only (internal charge pump generates VPP) |
| ISP temp. range | –40 °C to +100 °C (see note 11 in data sheet) |
8. Optional Factory Services
| Suffix | Description |
|---|---|
| -T | Tray supply (bulk) instead of tape & reel |
| -Q | Automotive-qualified flow (AEC-Q100, PPAP) – contact Intel-PSG |
| -ES | Engineering samples with reduced temperature range |
| -RDK | RoHS 5/6 exemption (high-temp solder balls) – obsolete |
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